Cart (0)
High-Speed Board-to-Board
High-Density Arrays
SEARAY™ 0.80 mm
SEAF8-RA
High-Speed Board-to-Board
High-Density Arrays
SEARAY™ 0.80 mm
SEAF8-RA

SEAF8-RA

  Configure Your Product Using the Options Below

SEAF8-RA

0.80 mm SEARAY™ High-Speed High-Density Open-Pin-Field Array Socket, Right-Angle

set logo

Configured Part Number
Check Pricing
View eCAD Files
.
.
Features

  • High-density open-pin-field array

  • Right-angle design

  • 0.80 mm (.0315") pitch

  • Rugged Edge Rate® contact

  • 28 Gbps performance

  • Lower insertion/withdrawal forces

  • Solder charge termination

  • Guide post option available

Specs Kit

Secured form. No spam.

. .
.
.
. .
.
Samtec Blog Logo