Flyover® Cable Technology

Compatible with all MSA QSFP pluggables

4 or 8 channel systems

Eye Speed® 100 ohm twinax cable

PCIe® 6.0/CXL® 3.1 capable

Press-fit tails for low speed signals/power to PCB

No re-timers required for reduced cost and power consumption

Improved thermal dissipation by allowing ICs to be placed in preferred locations

Multiple end 2 options available

Belly-to-belly mating for maximum density (FQSFP-DD Series)

Highest aggregate data rate on the market - 3,584 Gbps PAM4

16 & 32 diff pair configurations; accommodates PCIe® x4 or x8 plus sidebands

Cable-to-cable bulkhead panel connection using Flyover® cable technology

External Cable: 28 or 34 AWG twinax

Internal Cable: 34 AWG twinax

Single-Ended coax options also available

Full external EMI shielding

Multiple end 2 high-speed connector options available for your ASIC-adjacent Flyover® interconnect

Available in a threaded cable-to-panel design with a rugged 38999 shell for salt fog resistance to 48 hours and an IP67 sealed option (NVA3E/NVA3P)

Fully shielded external cable and cage for EMI protection

Enables 64 Gbps PAM4 (32 Gbps NRZ) electrical performance on 2.00 mm column pitch

PCIe® 6.0/CXL® 3.1 capable

24 to 72 pairs (4 and 6 pairs; 6, 8, 10 and 12 columns)

Single port cage designed for use with ExaMAX® right-angle board connector (EBTM-RA)

Rugged pull latch for mating/unmating

30 and 34 AWG Eye Speed® ultra low skew twinax cable

Individual signal wafers with staggered differential pair design

One-piece embossed ground structure on each signal wafer to reduce crosstalk

Roadmap: cable-to-cable bulkhead panel connection for increased performance to 112 Gbps PAM4

112 Gbps PAM4 per channel

4.0 Tbps aggregate data rate - 9 IEEE 400G channels

PCIe® 6.0/CXL® 3.1 capable

Innovative, fully shielded differential pair design enables extremely low crosstalk (beyond 40 GHz) and tight impedance control

Two points of contact ensure a more reliable connection

92 Ω solution addresses both 85 Ω and 100 Ω applications

Analog Over Array™ capable

Industry's highest density 112 Gbps PAM4 cable-to-board system

Data rate compatible with PCIe® 6.0/CXL® 3.1 and 100 GbE

32 to 72 differential pairs (up to 96 pairs on roadmap)

4 or 6 rows (8 rows on roadmap)

34 AWG Eye Speed® Thinax™ ultra low skew twinax cable, or 34 AWG Eye Speed® ThinSE™ micro coax cable

Differential pair configuration: 8 or 12 pairs per row; 4 or 6 rows (8 rows on roadmap)

Single-ended coax configuration: 12 or 18 coax per row; dedicated G-S-G-S-G layout for reduced crosstalk

Mixed differential pair and single-ended option available

Rugged squeeze latch for quick disconnect or locking tabs for maximum density (removal tool required)

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Incredibly slim 7.6 mm width

High-density 2-row design

Supports 64 Gbps PAM4 (32 Gbps NRZ) applications

PCIe® 6.0/CXL® 3.1 capable

8, 16 and 24 differential pair options available

16 differential pair option can support PCIe® x4 plus sidebands

24 differential pair option can support PCIe® x8 plus sidebands

34 AWG, 100 Ω Eye Speed® ultra low skew twinax cable

Improved signal integrity by eliminating transition board and its variability

Mating board level socket (ARF6 Series) features standard rugged weld tabs for increased stability on the PCB

Rugged metal latching and shielding

“Reversed Polarity” pinout option for reduced Far-End Crosstalk

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112 Gbps PAM4 performance

Eye Speed® 34 AWG, 92 Ω Thinax™ ultra performance twinax cable

One or two differential pairs

Vertical and right-angle mating board connector

Design flexibility as an End 2 option for Flyover® assemblies

Friction retention latching for a secure connection

Standard alignment pins

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0.60 mm pitch differential pair system

Supports 64 Gbps PAM4 (32 Gbps NRZ) applications

PCIe® 6.0/CXL® 3.1 capable

34 AWG Eye Speed® ultra low skew twinax

Edge Rate® contacts optimized for signal integrity performance

Mates with Generate® 0.60 mm pitch edge card socket (HSEC6-DV)

25.6 TB aggregate, path to 51.2 TB

PCIe® 6.0/CXL® 3.1 capable

On-package, pluggable interconnect

Ultra-high density

Uses direct connect technology to elude the BGA and route signals directly from the silicon package through a long-reach cable

5x the reach of traditional PCB solutions

Copper in development, optical solution on the roadmap

High-speed performance to 28 Gbps per lane

x4 and x12 designs

Interchangeability of copper and optical

Variety of integral heat sink and End 2 options

Micro rugged two-piece connector

Extended temperature and PCIe®-Over-Fiber solutions

Ultra-high density with up to 128 differential pairs in a single connector

56 Gbps NRZ/112 Gbps PAM4 performance per channel

Supports blind mate applications

Surface mount for better density and performance

Offset footprint for optimum signal integrity

Flyover® cable assembly in design

Enables 112 Gbps PAM4 electrical performance on a 2.00 mm column pitch

PCIe® 6.0/CXL® 3.1 capable

Utilizes Samtec’s Eye Speed® ultra low skew twinax cable technology for improved signal integrity, increased flexibility and routability

30 and 34 AWG to support various cable lengths

Two reliable points of contact with a 2.4 mm contact wipe

Highly customizable with modular flexibility

Reduce costs due to lower PCB layer counts

Wafer design increases isolation for reduced crosstalk; includes one sideband signal per column

16 to 96 staggered differential pairs provide higher data rates

Lowest mating force on the market: 0.36 N max per contact

Stub free mating

Power and Guide Modules available