High-Speed Board-to-Board

Mezzanine systems with integral ground planes, high-density arrays, ExaMAX® backplane interconnects, rugged Edge Rate® systems and high-speed performance to 28+ Gbps.

Mezzanine Strips

Mezzanine Strips

Board-to-board systems to 28+ Gbps performance featuring integral ground planes, rugged Edge Rate® contacts, slim body and low profile stack heights.


Q Strip®Q Strip® High-Speed Interconnects

Samtec Q Strip® connectors are designed for high-speed board-to-board applications where signal integrity is essential.

Features
  • Performance: Up to 14.0 GHz /28 Gbps
  • Integral ground/power plane
  • Connector to connector retention options
  • Vertical, perpendicular, and coplanar applications
  • Contacts: Up to 180 I/Os
  • Stack height: 5.00 mm - 25.00 mm
Series
V
  • QSE
  • QSE-EM
  • QSH
  • QSH-RA
  • QSS
  • QSS-RA
  • QTE
  • QTH
  • QTH-RA
  • QTS
  • QTS-RA
Q Strip®

Q Pairs®Q Pairs® Differential Pair Interconnects

Samtec Q Pairs® connectors are designed for high-speed board-to-board applications where signal integrity is essential.

Features
  • Performance: Up to 10.5 GHz / 21 Gbps
  • Optimized for 100 ohm systems
  • Integral ground/power plane
  • Stack height: 5.00-25.00 mm
  • Contacts: Up to 100 pairs
Series
V
  • QSE-DP
  • QSH-DP
  • QSH-DP-RA
  • QSS-DP
  • QTE-DP
  • QTH-DP
  • QTH-DP-RA
  • QTS-DP
Q Pairs®

Q Rate®Q Rate® Slim, Rugged High-Speed Interconnects

Samtec Q Rate® connectors have a slim footprint, integral power/ground plane, and Edge Rate® contacts for superior SI performance.

Features
  • Performance: Up to 15 GHz / 30 Gbps
  • Rugged Edge Rate® contacts
  • Integral ground/power plane
  • Up to 156 positions
  • Slim footprint (less than 5.00 mm wide)
Series
V
  • QRF8
  • QRF8-DP
  • QRF8-RA
  • QRM8
  • QRM8-DP
  • QRM8-RA
Q Rate®

Q2™Q2™ Rugged, High-Speed Interconnects

These rugged, high-speed connectors feature a ground plane and high-wipe contacts.

Features
  • Performance: Up to 8.5 GHz / 17 Gbps
  • Increased insertion depth
  • Dual stage hot pluggable
  • Integral ground/power plane
  • Shielded option available
  • Power and RF ends options
  • Contacts: Up to 208 I/Os
  • Stack height: 10.00 mm - 16.00 mm
Series
V
  • QFS
  • QFS-DP
  • QFS-EM
  • QFS-PC
  • QFS-RA
  • QFSS
  • QFSS-DP
  • QFSS-DP-PC
  • QFSS-PC
  • QMS
  • QMS-DP
  • QMS-EM
  • QMS-PC
  • QMS-RA
  • QMSS
  • QMSS-DP
  • QMSS-DP-PC
  • QMSS-PC
Q2™

Edge Rate®Edge Rate® Connector Strips

Rugged Edge Rate® contact systems optimized for signal integrity performance.

Features
  • Edge Rate® contacts optimized for signal integrity performance
  • Robust when "zippered" during unmating
  • 0.80 mm or 0.50 mm pitch systems
  • Stack heights from 7 mm to 16 mm
  • 0.50 mm pitch system for up to 40% PCB space savings
Series
V
  • ERF5
  • ERF5-RA
  • ERF8
  • ERF8-EM
  • ERF8-RA
  • ERM5
  • ERM8
  • ERM8-EM
  • ERM8-RA
Edge Rate®

Razor Beam™Razor Beam™

High-speed, high-density Razor Beam™ self-mating systems reduce inventory costs and are available in a variety of pitches and lead styles for increased flexibility.

Features
  • 10 stack height options from 5 mm to 12 mm
  • Audible click when mated
  • Mating and unmating forces approximately 4-6x greater than typical micro pitch connectors
  • Up to 100 contacts
Series
V
  • JSO
  • LSEM
  • LSHM
  • LSS
Razor Beam™

Edge Rate® High-DensityEdge Rate® High-Density Multi-Row Mezzanine Strips

These 0.635 mm pitch high-density multi-row mezzanine strips feature high-speed Edge Rate® contacts in a slim, 5 mm width.

Features
  • Incredibly dense with up to 240 total I/Os
  • Low profile 5 mm stack height
  • Slim body down to 2.5 mm
  • 2 and 4-row designs; 10 - 60 positions per row (20 - 240 total positions)
  • Edge Rate® contact systems optimized for signal integrity performance
  • Supports 56 Gbps PAM4 (28 Gbps NRZ) applications
  • Solder ball technology for simplified processing and self aligning (4-row)
  • J lead for standard processing (2-row)
  • Additional stack heights and higher pin counts in development
Series
V
  • EDF6
  • EDM6
  • ESF6
  • ESM6
Edge Rate® High-Density

Rugged High-Speed Strips

Rugged High-Speed Strips

Board-to-board systems with rugged Edge Rate® contacts, increased insertion depths, and rugged designs for contact protection during mating and unmating.


Q2™Q2™ Rugged/High-Speed Interconnects

These rugged, high-speed connectors feature a ground plane and high-wipe contacts.

Features
  • Performance: Up to 8.5 GHz / 17 Gbps
  • Increased insertion depth
  • Dual stage hot pluggable
  • Integral ground/power plane
  • Shielded option available
  • Power and RF ends options
  • Contacts: Up to 208 I/Os
  • Stack height: 10.00 mm - 16.00 mm
Series
V
  • QFS
  • QFS-DP
  • QFS-EM
  • QFS-PC
  • QFS-RA
  • QFSS
  • QFSS-DP
  • QFSS-DP-PC
  • QFSS-PC
  • QMS
  • QMS-DP
  • QMS-EM
  • QMS-PC
  • QMS-RA
  • QMSS
  • QMSS-DP
  • QMSS-DP-PC
  • QMSS-PC
Q2™

Edge Rate®Edge Rate® Connector Strips

Rugged Edge Rate® contact systems optimized for signal integrity performance.

Features
  • Edge Rate® contacts optimized for signal integrity performance
  • Robust when "zippered" during unmating
  • 0.80 mm or 0.50 mm pitch systems
  • Stack heights from 7 mm to 16 mm
  • 0.50 mm pitch system for up to 40% PCB space savings
Series
V
  • ERF5
  • ERF5-RA
  • ERF8
  • ERF8-EM
  • ERF8-RA
  • ERM5
  • ERM8
  • ERM8-EM
  • ERM8-RA
Edge Rate®

Q Rate®Q Rate® Slim, Rugged High-Speed Interconnects

Samtec Q Rate® connectors have a slim footprint, integral power/ground plane, and Edge Rate® contacts for superior SI performance.

Features
  • Performance: Up to 15 GHz / 30 Gbps
  • Rugged Edge Rate® contacts
  • Integral ground/power plane
  • Up to 156 positions
  • Slim footprint (less than 5.00 mm wide)
Series
V
  • QRF8
  • QRF8-DP
  • QRF8-RA
  • QRM8
  • QRM8-DP
  • QRM8-RA
Q Rate®

Razor Beam™Razor Beam™

High-speed, high-density Razor Beam™ self-mating systems reduce inventory costs and are available in a variety of pitches and lead styles for increased flexibility.

Features
  • 10 stack height options from 5 mm to 12 mm
  • Audible click when mated
  • Mating and unmating forces approximately 4-6x greater than typical micro pitch connectors
  • Up to 100 contacts
Series
V
  • JSO
  • LSEM
  • LSHM
  • LSS
Razor Beam™

Floating Contact SystemFloating Contact System

High-speed floating contact system minimizes mating alignment errors.

Features
  • Provides 0.50 mm (.0197") float in X and Y directions
  • Ideal for multiple connectors on a board
  • Up to 60 floating contacts
  • Choice of body height and right-angle design
Series
V
  • FS5
  • FT5
Floating Contact System

High-Density Arrays

High-Density Arrays

High-density grid arrays on a variety of pitches, stack heights, and configurations for maximum routing, grounding, and design flexibility.


ExaMAX®Samtec ExaMAX® High-Speed Backplane System

ExaMAX® high-speed backplane interconnects deliver 56 Gbps electrical performance.

Features
  • Enables 56 Gbps electrical performance on 2.00 mm column pitch
  • Allows designers to optimize density or minimize board layer count
  • Two reliable points of contact, even when subjected to angled mating
  • Meets Telcordia GR-1217 CORE specification
  • Individual signal wafers with staggered differential pair design; 72 or 40 pairs
  • One-piece embossed ground structure on each signal wafer to reduce crosstalk
  • Lowest mating force on the market: 0.36 N max per contact
  • Stub free mating
  • Press fit termination
  • Power and Guide Modules available
Series
V
  • EBDM-RA
  • EBTF-RA
  • EBTM
  • EGBF
  • EGBM
  • EPTS
  • EPTT
ExaMAX®

SEARAY™SEARAY™ High-Density Open Pin Field Arrays

These high-speed, high-density open pin field arrays allow maximum grounding and routing flexibility.

Features
  • Maximum routing and grounding flexibility
  • Lower insertion/extraction forces vs. typical array products
  • Performance up to 18 GHz/pair
  • Up to 500 I/Os in open pin field design
  • 1.27 mm (.050") pitch and space saving 0.80 mm pitch
  • Rugged Edge Rate® contact system
  • Can be "zippered" during mating/unmating
  • Solder charge terminations for ease of processing
  • Meets Extended Life Product™ (E.L.P.™) standards
  • 7 - 17 mm stack heights
  • Vertical, right-angle, press-fit
  • Elevated systems to 40 mm
  • 85 ohm systems
  • VITA 47, VITA 57, Pismo 2 certified
  • IPC J-STD-001F, requirements for soldered electrical and electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products (SEAM/SEAF series only)
  • IPC-A-610F, acceptability of electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products (SEAM/SEAF series only)
Series
V
  • JSO
  • SEAF
  • SEAFP
  • SEAFP-RA
  • SEAF-RA
  • SEAM
  • SEAMI
  • SEAMP
  • SEAM-RA
  • SEAR
  • UBPS
  • UBPT
SEARAY™

SEARAY™ 0.80 mmSEARAY™ 0.80 mm Pitch Ultra High-Density Arrays

These ultra high-density, high-speed open pin field arrays feature a 0.80 mm pitch for up to 50% board space savings.

Features
  • 0.80 mm (.0315") pitch grid
  • 50% board space savings versus .050" (1.27 mm) pitch SEARAY™
  • Performance: Up to 17.5 GHz / 35 Gbps
  • Rugged Edge Rate® contact system
  • Up to 500 I/Os
  • 7 mm and 10 mm stack heights
  • Solder charge terminations for ease of processing
  • Samtec 28+ Gbps Solution
  • Final Inch® certified for Break Out Region trace routing recommendations (patent pending)
Series
V
  • JSO
  • SEAF8
  • SEAF8-RA
  • SEAM8
  • UBPS
  • UBPT
SEARAY™ 0.80 mm

SkyRay™SkyRay™ High-Speed Elevated Arrays

This three-piece system features crosstalk-canceling technology delivering 28+ Gbps performance at elevated stack heights.

Features
  • Three-piece system
  • Crosstalk canceling technology
  • 28+ Gbps solution
  • 35 mm standard stack height aids in system airflow
  • Three-piece system reduces thermal mass during processing
  • 50, 100, and 150 differential pairs
  • 18 mm – 40 mm stack heights available
  • 1.50 mm x 1.75 mm pitch
  • Dual sourced By Hirose®
Series
V
  • TPAF
  • TPAR
SkyRay™

DP Array®Dedicated Differential Pair DP Array®

Dedicated differential pair, high-density arrays designed for performance up to a terabit per connector.

Features
  • Perimeter grounds and staggered pin layout eliminate interstitial grounds and make board routing easier
  • No return paths needed
  • Fewer board layers required
  • Performance: Up to 4 GHz per pair (up to a terabit per connector)
  • Up to 168 usable pairs
  • 10 mm stack height
  • Lower insertion / extraction forces
  • Solder crimp termination
Series
V
  • DPAF
  • DPAM
DP Array®

HD MezzHD Mezz

Elevated high-density open pin field arrays up to 35 mm stack heights.

Features
  • Application specific capability to stack heights from 20 mm to 35 mm
  • Open pin field design
  • Performance: Up to 9 GHz / 18 Gbps
  • Integrated guide posts to minimize contact damage when mating and unmating
  • Solder charge terminations for ease of processing
  • 2.00 mm x 1.20 mm pitch
  • Up to 299 I/Os
  • Intermateable with Molex HD Mezz Arrays
  • HD Mezz is a trademark of Molex Incorporated
Series
V
  • HDAF
  • HDAM
HD Mezz

LP Array™LP Array™ Low Profile Open-Pin-Field Arrays

Low profile open-pin-field arrays down to 4 mm stack height and up to 320 total I/Os.

Features
  • 4 mm, 4.5 mm, 5 mm stack heights
  • Up to 320 I/Os
  • 4, 6 and 8 row designs
  • .050" (1.27 mm) pitch
  • Dual beam contact system
  • Solder crimp termination for ease of processing
  • Performance up to 18.5 GHz / 37 Gbps
Series
V
  • JSO
  • LPAF
  • LPAM
LP Array™

Low Profile One-Piece ArraysLow Profile One-Piece Compression Arrays

High-speed low profile one-piece compression arrays with body height as low as 1.27 mm and dual or single compression contacts.

Features
  • 1.27 mm and 2 mm standard body heights
  • 1.00 mm pitch
  • Dual compression or single compression with solder balls
  • 100 – 400 total pins
  • Ideal for low cost board stacking, module-to-board and LGA interfaces
  • Minimizes thermal expansion issues
Series
V
  • GMI
Low Profile One-Piece Arrays

Z-Ray® Ultra-Low Profile ArraysZ-Ray® Ultra-Low Profile Arrays

Z-Ray® ultra-low profile, high-density one-piece arrays with compression contacts.

Features
  • 1 mm standard body height
  • Dual compression contacts
  • Single compression with solder ball
  • Performance up to 20 GHz / 40 Gbps
  • 0.80 mm or 1.00 mm pitch standard
  • Highly customizable system
Series
V
  • ZA1
  • ZA8
  • ZA8H
  • ZD
  • ZHSI
  • ZSO
Z-Ray® Ultra-Low Profile Arrays

Ultra Micro

Ultra Micro

Ultra-fine pitch, ultra-low profile and ultra-slim body interconnects with 28+ Gbps performance.


Razor Beam™ LPRazor Beam™ LP

Ultra slim, ultra low profile and ultra fine pitch interconnects.

Features
  • Ultra fine pitch – 0.40 mm and 0.50 mm
  • Ultra low stack down to 2.00 mm
  • Slim body design for increased board space savings
Series
V
  • SLH
  • SS4
  • SS5
  • ST4
  • ST5
  • TLH
Razor Beam™ LP

Edge Rate®Edge Rate® Connector Strips

Rugged Edge Rate® contact systems optimized for signal integrity performance.

Features
  • Edge Rate® contacts optimized for signal integrity performance
  • Robust when "zippered" during unmating
  • 0.80 mm or 0.50 mm pitch systems
  • Stack heights from 7 mm to 16 mm
  • 0.50 mm pitch system for up to 40% PCB space savings
Series
V
  • ERF5
  • ERF5-RA
  • ERF8
  • ERF8-EM
  • ERF8-RA
  • ERM5
  • ERM8
  • ERM8-EM
  • ERM8-RA
Edge Rate®

Razor Beam™Razor Beam™

High-speed, high-density Razor Beam™ self-mating systems reduce inventory costs and are available in a variety of pitches and lead styles for increased flexibility.

Features
  • 10 stack height options from 5 mm to 12 mm
  • Audible click when mated
  • Mating and unmating forces approximately 4-6x greater than typical micro pitch connectors
  • Up to 100 contacts
Series
V
  • JSO
  • LSEM
  • LSHM
  • LSS
Razor Beam™

SEARAY™ 0.80 mmSEARAY™ 0.80 mm Pitch Ultra High-Density Arrays

These ultra high-density, high-speed open pin field arrays feature a 0.80 mm pitch for up to 50% board space savings.

Features
  • 0.80 mm (.0315") pitch grid
  • 50% board space savings versus .050" (1.27 mm) pitch SEARAY™
  • Performance: Up to 17.5 GHz / 35 Gbps
  • Rugged Edge Rate® contact system
  • Up to 500 I/Os
  • 7 mm and 10 mm stack heights
  • Solder charge terminations for ease of processing
  • Samtec 28+ Gbps Solution
  • Final Inch® certified for Break Out Region trace routing recommendations (patent pending)
Series
V
  • JSO
  • SEAF8
  • SEAF8-RA
  • SEAM8
  • UBPS
  • UBPT
SEARAY™ 0.80 mm

LP Array™LP Array™ Low Profile Open-Pin-Field Arrays

Low profile open-pin-field arrays down to 4 mm stack height and up to 320 total I/Os.

Features
  • 4 mm, 4.5 mm, 5 mm stack heights
  • Up to 320 I/Os
  • 4, 6 and 8 row designs
  • .050" (1.27 mm) pitch
  • Dual beam contact system
  • Solder crimp termination for ease of processing
  • Performance up to 18.5 GHz / 37 Gbps
Series
V
  • JSO
  • LPAF
  • LPAM
LP Array™

Z-Ray® Ultra-Low Profile ArraysZ-Ray® Ultra-Low Profile Arrays

Z-Ray® ultra-low profile, high-density one-piece arrays with compression contacts.

Features
  • 1 mm standard body height
  • Dual compression contacts
  • Single compression with solder ball
  • Performance up to 20 GHz / 40 Gbps
  • 0.80 mm or 1.00 mm pitch standard
  • Highly customizable system
Series
V
  • ZA1
  • ZA8
  • ZA8H
  • ZD
  • ZHSI
  • ZSO
Z-Ray® Ultra-Low Profile Arrays

Edge Rate® High-DensityEdge Rate® High-Density Multi-Row Mezzanine Strips

These 0.635 mm pitch high-density multi-row mezzanine strips feature high-speed Edge Rate® contacts in a slim, 5 mm width.

Features
  • Incredibly dense with up to 240 total I/Os
  • Low profile 5 mm stack height
  • Slim body down to 2.5 mm
  • 2 and 4-row designs; 10 - 60 positions per row (20 - 240 total positions)
  • Edge Rate® contact systems optimized for signal integrity performance
  • Supports 56 Gbps PAM4 (28 Gbps NRZ) applications
  • J lead for standard processing (2-row)
  • Additional stack heights and higher pin counts in development
Series
V
  • EDF6
  • EDM6
  • ESF6
  • ESM6
Edge Rate® High-Density

High-Isolation

High-Isolation

Cost saving, high-performance RF solutions for board-to-board and cable-to-board applications.


IsoRate®IsoRate® RF Systems

IsoRate® is a high-isolation interconnect system that can offer substantial savings over traditional RF connectors at approximately half the cost.

Features
  • Half the cost of traditional RF at virtually the same performance
  • Edge Rate® contacts for high-isolation
  • 50 ohm board-to-board systems
  • 50 ohm full ganged system or ganged with industry standard end 2 options
  • Positive latching available
Series
V
  • IJ5
  • IJ5C
  • IJ5H
  • IP5
IsoRate®

Floating RF SystemsFloating RF Systems

Three piece "bullet" style systems offering misalignment compensation.

Features
  • Compensates for misalignment in X & Y directions
  • Frequency range (SMP): DC to 40 GHz
  • Frequency range (AFI): DC to 6 GHz
  • Bullet adaptors allow for flexible connections
Series
V
  • AFI-B
  • AFI-EM
  • AFI-MT
  • AFI-SM
  • SMP-B
  • SMP-EM
  • SMP-TH
Floating RF Systems

Ganged Micro ScaleGanged Micro Scale RF Systems

Samtec's ganged micro-miniature high-performance solutions are on a 5.00 mm pitch and available as board-to-board or cable-to-board systems.

Features
  • Performance up to 6 GHz
  • 50 ohm and 75 ohm solutions
  • Full ganged system or ganged with industry standard end 2 options
  • Micro-miniature, rugged contacts
  • Optional captive panel screws
  • Single or double-ended cable assemblies
  • Optional threaded inserts
Series
V
  • GRF1-C
  • GRF1H-C
  • GRF1-J
  • GRF1-P
  • GRF7-C
  • GRF7H-C
  • GRF7-J
  • GRF7-P
Ganged Micro Scale

28+ Gbps Solutions

28+ Gbps Solutions

Full line of interconnects designed to support serial speeds of 28 Gbps or more.


28+ Gbps SolutionsHigh-speed interconnects that support 28+ Gbps requirements

Samtec has developed a full line of connector products that are designed to support serial speeds of 28 Gbps or more.

Features
  • 0.40 mm, 0.50 mm, 0.80 mm, 0.635 mm, 1.00 mm, .050" or 2.00 mm pitch
  • Pin counts from 10 to 500
  • Stack heights from 1 mm to 30 mm
  • Vertical and horizontal orientations
Series
V
  • ERF5
  • ERF8
  • ERM5
  • ERM8
  • HSEC8-DV
  • HSEC8-DV
  • HSEC8-PV
  • HSEC8-PV
  • LPAF
  • LPAM
  • LSEM
  • MEC2-DV
  • MECF-DV
  • QFS
  • QMS
  • QRF8
  • QRF8-DP
  • QRF8-RA
  • QRM8
  • QRM8-DP
  • QRM8-RA
  • QSE
  • QSH
  • QTE
  • QTH
  • SEAF
  • SEAF8
  • SEAM
  • SEAM8
  • SEAMI
  • SEM
  • SS4
  • SS5
  • ST4
  • ST5
  • TEM
  • TPAF
  • TPAR
  • ZA1
  • ZA8
28+ Gbps Solutions

Samtec is expanding its line of ExaMAX® high speed backplane connectors. The new system is a direct mate orthogonal (DMO) configuration. These products were recently on display at SC17 in Denver. In the video above, Jonathan Sprigler, Samtec’s Backplane Product Manager, tells us ...
This time of year is typically set aside for preparation, and this year is no different. We spent November working on a couple of major upgrades to prepare for releases in 2018, one with the way we handle quotes in My Samtec, and the other with how we handle the checkout experien...
There are few words in an electrical engineer’s life that make them cringe more than EMI (Electromagnetic Interference).  From noise on the lines to crippling entire infrastructures, whether large or small, EMI presents a serious problem. As all active electrical systems emit ele...
As with any product development, ASIC designers aim to quicken time to market and reduce unnecessary design cycles. Designing full-custom ASICs comes with many benefits but leveraging the flexibility, configurability and high-performance of FPGAs has become a preferred method for...
The 28 Gbps Product Demonstrator is an active system that showcases a variety of Samtec interconnect products at 28 Gbps and beyond. The Demonstrator was up and running at SC17, and Anthony Fellbaum was there also, where he walked us through the demo. Real World 28 Gbps This demo...
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