triangle alert Samtec manufacturing capacity has been influenced by this pandemic. Our global operations team is working tirelessly to maximize output and minimize impact to customers while prioritizing COVID-19 critical response applications. Some part numbers are experiencing delays, but many are not. For the most up-to-date and accurate lead times use your My Samtec account, chat, or call us anytime for the latest information. ×
triangle alert Samtec manufacturing capacity has been influenced by this pandemic. Our global operations team is working tirelessly to maximize output and minimize impact to customers while prioritizing COVID-19 critical response applications. Some part numbers are experiencing delays, but many are not. For the most up-to-date and accurate lead times use your My Samtec account, chat, or call us anytime for the latest information. ×

Dedicated high-density differential pair array designed for performance up to one terabit per connector.

FEATURES

  • Perimeter grounds and staggered pin layout eliminate interstitial grounds and make board routing easier
  • No return paths needed
  • Fewer board layers required
  • Performance: Up to 4 GHz per pair (up to a terabit per connector)
  • Up to 168 usable pairs
  • 10 mm stack height
  • Lower insertion / extraction forces
  • Solder crimp termination

VIDEOS

Samtec Advanced Interconnect Design Tech Center

Products

DPAF

.085" X .100" DP Array® Differential Pair Array Socket

Features
  • Perimeter grounds and staggered pin layout eliminate interstitial grounds and make board routing easier
  • No return paths needed
  • Fewer board layers required
  • Performance: Up to 4 GHz per pair (up to a terabit per connector)
  • Up to 168 usable pairs
  • 10 mm stack height
  • Lower insertion / extraction forces
  • Solder crimp termination
.085" X .100" DP Array® Differential Pair Array Socket

DPAM

.085" X .100" DP Array® Differential Pair Array Terminal

Features
  • Perimeter grounds and staggered pin layout eliminate interstitial grounds and make board routing easier
  • No return paths needed
  • Fewer board layers required
  • Performance: Up to 4 GHz per pair (up to a terabit per connector)
  • Up to 168 usable pairs
  • 10 mm stack height
  • Lower insertion / extraction forces
  • Solder crimp termination
.085" X .100" DP Array® Differential Pair Array Terminal

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