HD Mezz Array
Elevated HD Mezz high-density open pin field arrays up to 35 mm stack heights.
FEATURES
- Application specific capability to stack heights from 20 mm to 35 mm
- Open pin field design
- Performance: Up to 9 GHz / 18 Gbps
- Integrated guide posts to minimize contact damage when mating and unmating
- Solder charge terminations for ease of processing
- 2.00 mm x 1.20 mm pitch
- Up to 299 I/Os
- Intermateable with Molex HD Mezz Arrays
- HD Mezz is a trademark of Molex Incorporated
HDAF
2.00 mm x 1.20 mm HD Mezz Rugged, High-Density Open-Pin-Field Array Socket
Features
- Application specific capability to build any height from 20 mm to 35 mm
- Open pin field design
- Integrated guide posts to minimize contact damage when mating and unmating
- Solder charge termination for ease of processing
- Performance: Up to 9 GHz / 18 Gbps
- 2.00 mm x 1.20 mm pitch
- Up to 299 I/Os
- Intermateable with Molex HD Mezz Arrays
- HD Mezz is a trademark of Molex Incorporated
- Dual sourced by Molex®
HDAM
2.00 mm x 1.20 mm HD Mezz Rugged, High-Density Open-Pin-Field Array Terminal
Features
- Open pin field design
- Integrated guide posts to minimize contact damage when mating and unmating
- Solder charge termination for ease of processing
- Performance: Up to 9 GHz / 18 Gbps
- 2.00 mm x 1.20 mm pitch
- Up to 299 I/Os
- Intermateable with Molex HD Mezz Arrays
- HD Mezz is a trademark of Molex Incorporated
- Dual sourced by Molex®
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