Elevated high-density open pin field arrays up to 35 mm stack heights.

FEATURES

  • Application specific capability to stack heights from 20 mm to 35 mm
  • Open pin field design
  • Performance: Up to 9 GHz / 18 Gbps
  • Integrated guide posts to minimize contact damage when mating and unmating
  • Solder charge terminations for ease of processing
  • 2.00 mm x 1.20 mm pitch
  • Up to 299 I/Os
  • Intermateable with Molex HD Mezz Arrays
  • HD Mezz is a trademark of Molex Incorporated

SERIES

HDAF

2.00 mm x 1.20 mm HD Mezz Rugged, High-Density Open-Pin-Field Array Socket

Features
  • Application specific capability to build any height from 20 mm to 35 mm
  • Open pin field design
  • Integrated guide posts to minimize contact damage when mating and unmating
  • Solder charge termination for ease of processing
  • Performance: Up to 9 GHz / 18 Gbps
  • 2.00 mm x 1.20 mm pitch
  • Up to 299 I/Os
  • Intermateable with Molex HD Mezz Arrays
  • HD Mezz is a trademark of Molex Incorporated
  • Dual sourced by Molex®
2.00 mm x 1.20 mm HD Mezz Rugged, High-Density Open-Pin-Field Array Socket

HDAM

2.00 mm x 1.20 mm HD Mezz Rugged, High-Density Open-Pin-Field Array Terminal

Features
  • Open pin field design
  • Integrated guide posts to minimize contact damage when mating and unmating
  • Solder charge termination for ease of processing
  • Performance: Up to 9 GHz / 18 Gbps
  • 2.00 mm x 1.20 mm pitch
  • Up to 299 I/Os
  • Intermateable with Molex HD Mezz Arrays
  • HD Mezz is a trademark of Molex Incorporated
  • Dual sourced by Molex®
2.00 mm x 1.20 mm HD Mezz Rugged, High-Density Open-Pin-Field Array Terminal

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