HD Mezz

Elevated high-density open pin field arrays up to 35 mm stack heights.

FEATURES

Application specific capability to stack heights from 20 mm to 35 mm
Open pin field design
Performance: Up to 9 GHz / 18 Gbps
Integrated guide posts to minimize contact damage when mating and unmating
Solder charge terminations for ease of processing
2.00 mm x 1.20 mm pitch
Up to 299 I/Os
Intermateable with Molex HD Mezz Arrays
HD Mezz is a trademark of Molex Incorporated

DOWNLOADS

Technology Centers: Advanced Interconnect Design Video

SERIES

HDAF

2.00 mm x 1.20 mm HD Mezz Rugged, High-Density Open-Pin-Field Array Socket

Features

Application specific capability to build any height from 20 mm to 35 mm
Open pin field design
Integrated guide posts to minimize contact damage when mating and unmating
Solder charge termination for ease of processing
Performance: Up to 9 GHz / 18 Gbps
2.00 mm x 1.20 mm pitch
Up to 299 I/Os
Intermateable with Molex HD Mezz Arrays
HD Mezz is a trademark of Molex Incorporated
Dual sourced by Molex®

Downloads

More Information

2.00 mm x 1.20 mm HD Mezz Rugged, High-Density Open-Pin-Field Array Socket

HDAM

2.00 mm x 1.20 mm HD Mezz Rugged, High-Density Open-Pin-Field Array Terminal

Features

Open pin field design
Integrated guide posts to minimize contact damage when mating and unmating
Solder charge termination for ease of processing
Performance: Up to 9 GHz / 18 Gbps
2.00 mm x 1.20 mm pitch
Up to 299 I/Os
Intermateable with Molex HD Mezz Arrays
HD Mezz is a trademark of Molex Incorporated
Dual sourced by Molex®

Downloads

More Information

2.00 mm x 1.20 mm HD Mezz Rugged, High-Density Open-Pin-Field Array Terminal

More High-Density Arrays

Downloads