Z-Ray® Ultra Low Profile Interposers

Ultra low profile, high density one piece arrays with compression contacts.


FAMILY OVERVIEW

Z-Ray® micro array interposers are ultra-low profile, high density, highly customizable solutions for board-to-board, IC-to-board, and cable-to-board applications.

BeCu micro-formed contacts, on 0.80 mm and 1.00 mm pitches, are available in a variety of standard and custom configurations, and in dual compression and single compression/solder ball designs. The contacts are assembled into rugged low profile FR4 substrate under high pressure and temperature.

BeCu micro-formed contacts, on 0.80 mm and 1.00 mm pitches, are available in a variety of standard and custom configurations, and in dual compression and single compression/solder ball designs. The contacts are assembled into rugged low profile FR4 substrate under high pressure and temperature.

FEATURES

Low Profile

  • Low profile 1 mm body height
  • Custom body height as low as 0.50 mm
  • High performance to 28+ Gbps
  • One piece design

High Density

  • Customer-specific pin counts for ultimate high density and speed flexibility
  • Choice of 0.80 mm or 1.00 mm pitch grid
  • ZA8 Series up to 1,200 contacts per square inch
  • ZA1 Series up to 1,024 contacts per square inch

Flexible Designs

  • Variety of standard and custom configurations
  • Dual compression or single compression and solder ball
  • Customer-specific stack heights, pin counts, insulator shapes, plating thicknesses
  • Customizable in the X, Y, and Z axes for ultra-micro applications
  • An array of sizes and shapes
    • Square, rectangle
    • Customer-specific shapes
    • Alignment and screw hole options

Construction

Specifications

  • 28+ Gbps
  • Up to 3,000 cycles (alternate contact design for up to 5,000 cycles; contact zray@samtec.com)
  • .008" contact deflection
  • 500 mA per line
  • 25 grams per line/normal force
  • Differential Vias™ PCB routing available

Hardware, Assembly

  • Designed for use with Samtec Z-Ray® interposers
  • For alignment, compression, and/or retention
  • For dual compression contacts or single compression solder ball designs
  • ZSO Series for single compression with solder balls
  • ZHSI Series for dual compression interposers
  • ZD Series for alignment for dual compression interposers

DOWNLOADS

Literature

Z-Ray® Interposer Application Design Guide

Z-Ray® Interposer Application Guide

Get
IC-to-Board

IC-to-Board

Get
Compression Hardware e-brochure

Compression Hardware e-brochure

Get

Technical Documents

SERIES

ZA1

1.00 mm Ultra Low Profile Micro Array

Features
  • Low profile - 1 mm standard height
  • Ideal for board stacking, module-to-board and LGA interfaces
  • Allows easy field upgrade, exchange
  • Minimizes thermal expansion issues
  • Up to 400 I/Os
  • 1.00 mm (.0394") pitch
  • Samtec 28+ Gbps Solution
1.00 mm Ultra Low Profile Micro Array

ZA8

0.80 mm Ultra Low Profile Micro Array

Features
  • Low profile - 1 mm standard height
  • Ideal for board stacking, module-to-board and LGA interfaces
  • Allows easy field upgrade, exchange
  • Minimizes thermal expansion issues
  • Up to 400 I/Os
  • 0.80 mm (.0315") pitch
  • Samtec 28+ Gbps Solution
0.80 mm Ultra Low Profile Micro Array

ZA8H

0.80 mm High-Speed Dual Compression Array

Features
  • Up to 43 Gbps high-speed channel performance
  • Extreme low profile provides the shortest signal path
  • Dual compression BeCu contacts
  • 0.33 mm body height
  • Up to 168 contacts: 4 or 7 rows with 3, 12 or 24 pairs per row
  • 25 g normal force with .008" (0.20 mm) contact deflection
0.80 mm High-Speed Dual Compression Array

ZD

Z-Ray® Alignment Dowel

Features
  • Alignment dowel
  • Provides alignment for ZA8 and ZA1 Series
Z-Ray® Alignment Dowel

ZHSI

Z-Ray® Press-Fit Alignment Hardware

Features
Z-Ray® Press-Fit Alignment Hardware

ZSO

Z-Ray® Press-Fit Alignment Hardware

Features
  • Press-fit
  • Provides alignment for ZA8 and ZA1 Series
Z-Ray® Press-Fit Alignment Hardware

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