triangle alert Samtec manufacturing capacity has been influenced by this pandemic. Our global operations team is working tirelessly to maximize output and minimize impact to customers while prioritizing COVID-19 critical response applications. Some part numbers are experiencing delays, but many are not. For the most up-to-date and accurate lead times use your My Samtec account, chat, or call us anytime for the latest information. ×
triangle alert Samtec manufacturing capacity has been influenced by this pandemic. Our global operations team is working tirelessly to maximize output and minimize impact to customers while prioritizing COVID-19 critical response applications. Some part numbers are experiencing delays, but many are not. For the most up-to-date and accurate lead times use your My Samtec account, chat, or call us anytime for the latest information. ×

SEARAY™ 0.80 mm Pitch Ultra High-Density Arrays

SEARAY™ 0.80 mm Pitch Ultra High-Density Arrays

These ultra high density, high speed open-pin-field arrays feature a 0.80 mm pitch grid for up to 50% board space savings.


FAMILY OVERVIEW

searayultralp video

These ultra high density, high speed open-pin-field arrays feature a 0.80 mm pitch grid for up to 50% board space savings compared to .050" pitch SEARAY™ interconnects. With up to 500 total Edge Rate® contacts optimized for signal integrity, this system allows for maximum grounding and routing flexibility. Features include up to 10 rows and 50 contacts per row, choice of 7 mm or 10 mm stack height, and high speed 28+ Gbps performance.

The socket is also available in right angle for micro backplane applications with optional guide posts for blind mating. Individual power modules with press fit tails provide a high power option for greater system flexibility.

searay ultralp poster

The socket is also available in right angle for micro backplane applications with optional guide posts for blind mating. Individual power modules with press fit tails provide a high power option for greater system flexibility.

FEATURES

  • 0.80 mm (.0315") pitch grid
  • 50% board space savings versus .050" (1.27 mm) pitch SEARAY™
  • Performance: Up to 17.5 GHz / 35 Gbps
  • Rugged Edge Rate® contact system
  • Up to 500 I/Os
  • 7 mm and 10 mm stack heights
  • Solder charge terminations for ease of processing
  • Samtec 28+ Gbps Solution
  • Final Inch® certified for Break Out Region trace routing recommendations
open-pin-field Flexibility

DOWNLOADS

Literature

SEARAY™ eBrochure

SEARAY™ 0.80 eBrochure

Get
Micro Rugged Application Design Guide

Micro Rugged Application Design Guide

Get
Broadcast Video Solutions Guide

Broadcast Video Solutions Guide

Get
High-Speed Board-to-Board Application Guide

High-Speed Board-to-Board Application Guide

Get

VIDEOS

Jack Screw Standoffs for High-Normal-Force Applications (JSO & JSOM)

Samtec Advanced Interconnect Design Tech Center

Products

SEAM8

0.80 mm SEARAY™ High-Speed High-Density Open-Pin-Field Array Terminal

Features
  • 0.80 mm (.0315") pitch
  • 50% board space savings versus .050" pitch SEARAY™
  • Rugged Edge Rate® contact system
  • 56 Gbps PAM4 performance
  • Lower insertion/withdrawal forces
  • Solder charge termination
  • 7 mm and 10 mm stack heights
0.80 mm SEARAY™ High-Speed High-Density Open-Pin-Field Array Terminal

SEAF8

0.80 mm SEARAY™ High-Speed High-Density Open-Pin-Field Array Socket

Features
  • 0.80 mm (.0315") pitch
  • 50% board space savings versus .050" pitch SEARAY™
  • Rugged Edge Rate® contact system
  • 56 Gbps PAM4 performance
  • Lower insertion/withdrawal forces
  • Solder charge termination
  • 7 mm and 10 mm stack heights
0.80 mm SEARAY™ High-Speed High-Density Open-Pin-Field Array Socket

SEAF8-RA

0.80 mm SEARAY™ High-Speed High-Density Open-Pin-Field Array Socket, Right-Angle

Features
  • High-density open-pin-field array
  • Right-angle design
  • 0.80 mm (.0315") pitch
  • Rugged Edge Rate® contact
  • 28 Gbps performance
  • Lower insertion/withdrawal forces
  • Solder charge termination
  • Guide post option available
0.80 mm SEARAY™ High-Speed High-Density Open-Pin-Field Array Socket, Right-Angle

JSO

Jack Screw Precision Board Stacking Standoff

Features
  • Works as a traditional standoff
  • Assists with unmating LSHM, SEAM/SEAF, SEAM8/SEAF8, LPAM/LPAF and other high-normal-force connectors
  • Reduces risk for component damage on boards
  • Board stacks from 4.00 mm to 16.00 mm
  • Press-fit and threaded bases available
Jack Screw Precision Board Stacking Standoff

CONTACT SALES

First Name
Last Name
Email
Company
Industry
Estimate Annual Usage
Family
Message

Don't want to fill out a form?
Chat with a product expert directly.

.
In June, we continued to upgrade several key pieces of content across the website, including more interactive product explorers on several pages and a homepage refresh. We also made a significant update to our product pages which allows logged-in users to see customer-specific pr...
The Military & Aerospace world utilizes products in harsh conditions, and the products must be able to properly perform. Because of this, many Mil/Aero manufacturers typically use full MIL-Spec products. Severe Environment Testing (SET) is a Samtec initiative to test certain prod...
“The customer is always right!” Anyone in customer service knows that motto. Pioneering businessmen César Ritz, Marshall Field, Harry Gordon Selfridge and others championed similar mantras throughout their careers. Today, Samtec lives and breathes Sudden Service®. In essence, Sam...
Samtec continues to grow its line of signal integrity connectors and cable systems, many rated at 28, 56 and 112 Gbps. These high-performance interconnects, typically used in digital applications, are finding new homes in the analog world. Small Form Factor A primary benefit of c...
Virtual. In a word, that sums up many of our everyday experiences. Gradually, virtual events were popping up. In the tech industry, virtual conferences and trade shows are the “New Normal.” One advantage of virtual, or digital, events seems to be popping up. Many in-person tech c...