SEARAY™ High-Density Open-Pin-Field Arrays

SEARAY™ High-Density Open-Pin-Field Arrays

These high speed, high density open-pin-field arrays allow maximum grounding and routing flexibility.


FAMILY OVERVIEW

Searay Video

Samtec's SEARAY™ products are the industry's largest offering of high speed, high density open-pin-field arrays. They support 28+ Gbps applications and are also Final Inch® certified for Break Out Region trace routing recommendations to save designers time and money.

SEARAY™ Open-Pin-Field Arrays feature a .050" x .050" (1.27 mm x 1.27 mm) pitch grid for maximum grounding and routing flexibility. This system is available in stack heights from 7 mm to 40 mm with up to 560 Edge Rate® contacts. Vertical or right-angle arrays (SEAM/SEAF Series) and a mating high speed cable assembly (SEAC Series) are available as 50 Ω or 100 Ω solutions. High retention press-fit tails (SEAMP/SEAFP Series) and an 85 Ω tuned interconnect (SEAMI Series) offer greater system flexibility. Elevated board stacking up to 40 mm is achieved by Samtec's high speed, high density riser (SEAR Series).

searay poster

Samtec's SEARAY™ products are the industry's largest offering of high speed, high density open-pin-field arrays. They support 28+ Gbps applications and are also Final Inch® certified for Break Out Region trace routing recommendations to save designers time and money.

FEATURES

  • Maximum routing and grounding flexibility
  • Lower insertion/extraction forces vs. typical array products
  • Performance up to 28 Gbps NRZ/56 Gbps PAM4
  • Up to 560 I/Os in an open-pin-field design
  • 1.27 mm (.050") pitch and space saving 0.80 mm pitch
  • Rugged Edge Rate® contact system
  • Can be "zippered" during mating/unmating
  • Solder charge terminations for ease of processing
  • Meets Extended Life Product™ (E.L.P.™) standards
  • 7 - 40 mm stack heights
  • Vertical, right-angle, press-fit
  • 85 Ω systems
  • VITA 47, VITA 57, Pismo 2 certified
  • IPC J-STD-001F, Requirements for Soldered Electrical and Electronic Assemblies – Meets Class 3 Acceptability Criteria for High Performance/Harsh Environment
  • Electronic Products (SEAM/SEAF Series only)
  • IPC-A-610F, Acceptability of Electronic Assemblies – Meets Class 3 Acceptability Criteria for High Performance/Harsh Environment Electronic Products (SEAM/SEAF Series only)
Searay Open Pin Assignment

SEARAY™ open-pin-field design gives customers the ability to simultaneously run differential pairs, single-ended signals and power though the same 28+ Gbps interconnect.

DOWNLOADS

Literature

Searay eBrochure

SEARAY™ eBrochure

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Micro Rugged Application Design Guide

Micro Rugged Application Design Guide

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Broadcast Video Solutions Guide

Broadcast Video Solutions Guide

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High-Speed Board-to-Board Application Guide

High-Speed Board-to-Board Application Guide

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Military/Aerospace Applications

Military/Aerospace Applications

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VIDEOS

SEARAY™ High Density Arrays

Samtec Advanced Interconnect Design Tech Center

Jack Screw Standoffs for High-Normal-Force Applications (JSO & JSOM)

SERIES

SEAF

.050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Socket

Features
  • Up to 500 I/Os
  • .050" (1.27 mm) pitch
  • Rugged Edge Rate® contact
  • 56 Gbps PAM4 performance
  • Stack heights from 7 mm - 18.5 mm
  • Lower insertion/withdrawal forces
  • Solder charge termination
  • Dual sourced by Molex®
  • IPC J-STD-001F, requirements for soldered electrical and electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products
  • IPC-A-610F, acceptability of electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products
.050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Socket

SEAM

.050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Terminal

Features
  • Up to 500 I/Os
  • .050" (1.27 mm) pitch
  • Rugged Edge Rate® contact
  • 56 Gbps PAM4 performance
  • Lower insertion/withdrawal forces
  • Solder charge termination
  • Stack heights from 7 mm - 18.5 mm
  • Dual sourced by Molex®
  • IPC J-STD-001F, requirements for soldered electrical and electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products
  • IPC-A-610F, acceptability of electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products
.050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Terminal

SEAF-RA

.050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Socket, Right-Angle

Features
  • High-density open-pin-field array
  • Right-angle design
  • .050" (1.27 mm) pitch
  • Rugged Edge Rate® contact
  • Lower insertion/withdrawal forces
  • Solder charge termination
  • Guide post, latching post options
.050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Socket, Right-Angle

SEAM-RA

.050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Terminal, Right-Angle

Features
  • High-density open-pin-field array
  • Right-angle design
  • .050" (1.27 mm) pitch
  • Rugged Edge Rate® contact
  • Lower insertion/withdrawal forces
  • Solder charge terminations
  • Guide post, latching post options
.050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Terminal, Right-Angle

SEAMP

.050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Terminal, Press-Fit

Features
  • Termination: Press-fit
  • High-density open-pin-field array
  • Rugged Edge Rate® contact
  • 28 Gbps performance
  • Lower insertion/withdrawal forces
  • 7 mm, 8 mm, 8.5 mm and 9.5 mm stacks
.050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Terminal, Press-Fit

SEAFP

.050" SEARAY™ High-Speed Open-Pin-Field Array Socket, Press-Fit

Features
  • High-density open-pin-field array
  • Press-fit tails
  • Rugged Edge Rate® contact
  • Lower insertion/withdrawal forces
  • 7 mm to 16 mm stack heights
.050" SEARAY™ High-Speed Open-Pin-Field Array Socket, Press-Fit

SEAFP-RA

.050" SEARAY™ High-Speed Open-Pin-Field Array Socket, Right-Angle Press-Fit

Features
  • High-density open-pin-field array
  • Press-fit tails
  • Rugged Edge Rate® contact
  • Lower insertion/withdrawal forces
  • Right-angle
.050" SEARAY™ High-Speed Open-Pin-Field Array Socket, Right-Angle Press-Fit

SEAR

.050" SEARAY™ High-Speed High-Density Riser, 85 Ohm

Features
  • SEARAY™ riser
  • Up to 40.00 mm stack
  • 85 ohm
.050" SEARAY™ High-Speed High-Density Riser, 85 Ohm

SEAMI

.050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Terminal, 85 Ohm

Features
  • High-density open-pin-field array
  • 85 ohm tuned
  • Performance up to 14 Gbps
.050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Terminal, 85 Ohm

JSO

Jack Screw Precision Board Stacking Standoff

Features
  • Works as a traditional standoff
  • Assists with unmating LSHM, SEAM/SEAF, SEAM8/SEAF8, LPAM/LPAF and other high-normal-force connectors
  • Reduces risk for component damage on boards
  • Board stacks from 4.00 mm to 16.00 mm
  • Press-fit and threaded bases available
Jack Screw Precision Board Stacking Standoff

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