This three-piece system features crosstalk-canceling technology delivering 28+ Gbps performance at elevated stack heights.

FEATURES

  • Three-piece system
  • Crosstalk canceling technology
  • 28+ Gbps solution
  • 35 mm standard stack height aids in system airflow
  • Three-piece system reduces thermal mass during processing
  • 50, 100, and 150 differential pairs
  • 18 mm – 40 mm stack heights available
  • 1.50 mm x 1.75 mm pitch
  • Dual sourced By Hirose®

SERIES

TPAR

1.50 mm X 1.75 mm High-Speed Elevated Array Riser

Features
  • Up to 300 signals, 150 pairs
  • 35 mm stack height standard, 18-40 mm stack height available
  • Dual sourced by Hirose® IT5
  • Selective gold Plating
  • UL: File # E111594
1.50 mm X 1.75 mm High-Speed Elevated Array Riser

TPAF

1.50 mm x 1.75 mm High-Speed Elevated Array Receptacle

Features
  • Up to 300 signals, 150 pairs
  • BGA (solder ball) technology
  • Low profile keeps thermal mass low for reflow processing
  • Dual sourced by Hirose® IT5
  • Selective gold Plating
  • UL: File # E111594
1.50 mm x 1.75 mm High-Speed Elevated Array Receptacle

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