High Density Connectors and Arrays
Build your mated connector set using Samtec’s High-Speed Board-to-Board Solutionator®. These high-density array connectors feature a variety of pitches, stack heights, and configurations for maximum routing, grounding, and design flexibility.
NovaRay®NovaRay® 112 Gbps PAM4 Array, Extreme Density Arrays
NovaRay® combines extreme density and performance for this 112 Gbps PAM4 array per channel in 40% less space than traditional arrays.
Features
- 112 Gbps PAM4 per channel
- 4.0 Tbps aggregate data rate - 9 IEEE 400G channels
- PCIe® 6.0/CXL® 3.1 capable
- Innovative, fully shielded differential pair design enables extremely low crosstalk (beyond 40 GHz) and tight impedance control
- Two points of contact ensure a more reliable connection
- 92 Ω solution addresses both 85 Ω and 100 Ω applications
- Analog Over Array™ capable
AcceleRate® HP High-Performance ArraysAcceleRate® HP High-Performance Arrays
AcceleRate® HP 0.635 mm pitch arrays feature 112 Gbps PAM4 extreme performance and a flexible open-pin-field design. View the full line of AcceleRate® products.
Features
- 0.635 mm pitch open-pin-field array
- 56 Gbps NRZ/112 Gbps PAM4 performance
- Cost optimized solution
- Low-profile 5 mm and up to 10 mm stack heights
- Up to 400 total pins available; roadmap to 1,000+ pins
- Data rate compatible with PCIe® 6.0/CXL® 3.1 and 100 GbE
- Analog Over Array™ capable
- View the full line of AcceleRate® products
AcceleRate® HDAcceleRate® HD Ultra-Dense, Slim Body Arrays
These 0.635 mm pitch high-density, open-pin-field arrays feature up to 400 high-speed Edge Rate® contacts in a slim, low-profile design. View the full line of AcceleRate® products.
Features
- Incredibly dense with up to 400 total I/Os
- Low profile 5 mm to 16 mm stack heights
- Slim 5 mm width
- 4-row design; 10 - 60 and 100 positions per row (40 - 400 total positions)
- Edge Rate® contact system optimized for signal integrity performance
- Supports 64 Gbps PAM4 (32 Gbps NRZ) applications
- PCIe® 6.0/CXL® 3.1 capable
- Additional stack heights in development
- View the full line of AcceleRate® products
AcceleRate® mPAcceleRate® mP High-Density, High-Speed Power/Signal Arrays
These 0.635 mm pitch power/signal arrays achieve 64 Gbps PAM4 speeds and feature rotated power blades for improved performance and simplified breakout region (BOR). View the full line of AcceleRate® products.
Features
- Best in class density for power and signal
- Power blades rotated 90º gives equal access to heat escape for uniform cooling, increased current capacity and reduced crowding
- Supports 64 Gbps PAM4 (32 Gbps NRZ) applications
- PCIe® 6.0/CXL® 3.1 capable
- Open-pin-field for grounding and routing flexibility
- High-density multi-row design
- Low profile 5 mm stack height; up to 16 mm in development
- 4 or 8 total power blades; up to 10 in development
- 60 or 240 total signal positions; additional position counts in development
- 0.635 mm signal pitch
- Optional alignment pins and weld tabs for a secure connection to the board
- Polarized guide posts for blind mating
- View the full line of AcceleRate® products
SEARAY™SEARAY™ High Density Open Pin Field Arrays
These high-speed, high-density open pin field arrays allow maximum grounding and routing flexibility.
Features
- Maximum routing and grounding flexibility
- Lower insertion/extraction forces vs. typical array products
- 56 Gbps PAM4 performance
- Up to 560 I/Os in open pin field design
- 1.27 mm (.050") pitch
- Rugged Edge Rate® contact system
- Can be "zippered" during mating/unmating
- Solder charge terminations for ease of processing
- Meets Extended Life Product™ (E.L.P.™) standards
- Analog Over Array™ capable
- 7 - 18.5 mm stack heights
- Vertical, right-angle, press-fit
- Elevated systems to 40 mm
- 85 ohm systems
- Standards: VITA 47, VITA 57.1 FMC, VITA 57.4 FMC+, VITA 74 VNX, PISMO™ 2
- IPC J-STD-001F, requirements for soldered electrical and electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products (SEAM/SEAF series only)
- IPC-A-610F, acceptability of electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products (SEAM/SEAF series only)
SEARAY™ 0.80 mmSEARAY™ 0.80 mm Pitch Ultra High-Density Arrays
These ultra high-density, high-speed open pin field arrays feature a 0.80 mm pitch for up to 50% board space savings.
Features
- 0.80 mm (.0315") pitch grid
- 50% board space savings versus .050" (1.27 mm) pitch arrays
- 28 Gbps NRZ/56 Gbps PAM4 performance
- Rugged Edge Rate® contact system
- Up to 500 I/Os
- 7 mm and 10 mm stack heights
- Solder charge terminations for ease of processing
- Final Inch® certified for Break Out Region trace routing recommendations
- Analog Over Array™ capable
LP Array™LP Array™ Low Profile Open-Pin-Field High-Density Array
These low profile open-pin-field arrays feature as low as a 4 mm stack height and up to 400 total I/Os.
Features
- 4 mm, 4.5 mm, 5 mm stack heights
- Up to 400 I/Os
- 4, 6 and 8 row designs
- .050" (1.27 mm) pitch
- Dual beam contact system
- Solder crimp termination for ease of processing
- 28 Gbps NRZ/56 Gbps PAM4 performance
- Analog Over Array™ capable
SUPERNOVA™ Low Profile One-Piece ArraysSUPERNOVA™ Low Profile One-Piece Compression Arrays
High-speed low profile one-piece compression arrays with body height as low as 1.27 mm and dual or single compression contacts.
Features
- 1.27 mm standard body height
- 1.00 mm pitch
- Dual compression or single compression with solder balls
- 100 – 300 total pins
- Ideal for low cost board stacking, module-to-board and LGA interfaces
- Minimizes thermal expansion issues
- Analog Over Array™ capable
ExaMAX®Samtec ExaMAX® High-Speed Backplane System
ExaMAX® high-speed backplane interconnects deliver 64 Gbps PAM4 (32 Gbps NRZ) electrical performance.
Features
- Enables 64 Gbps PAM4 (32 Gbps NRZ) electrical performance on 2.00 mm column pitch
- PCIe® 6.0/CXL® 3.1 capable
- Allows designers to optimize density or minimize board layer count
- Two reliable points of contact, even when subjected to angled mating
- Meets Telcordia GR-1217 CORE specification
- Individual signal wafers with staggered differential pair design; 24 - 72 pairs (board connectors) and 16 - 96 pairs (cable assemblies)
- One-piece embossed ground structure on each signal wafer to reduce crosstalk
- Lowest mating force on the market: 0.36 N max per contact
- Backplane cable assemblies improve signal integrity and increase signal path length at higher data rates
- Samtec’s Eye Speed® ultra low skew twinax cable provides increased flexibility and routability
- Stub free mating
- Press-fit termination
- Power and Guide Modules available
HD MezzHD Mezz Array
Elevated HD Mezz high-density open pin field arrays up to 35 mm stack heights.
Features
- Application specific capability to stack heights from 20 mm to 35 mm
- Open pin field design
- Performance: Up to 9 GHz / 18 Gbps
- Integrated guide posts to minimize contact damage when mating and unmating
- Solder charge terminations for ease of processing
- 2.00 mm x 1.20 mm pitch
- Up to 299 I/Os
- Intermateable with Molex HD Mezz Arrays
- HD Mezz is a trademark of Molex Incorporated
© 2024 Samtec. All rights reserved.
Your Privacy Choices