SEARAY™ 0.80 mm Pitch Ultra High-Density Arrays
SEARAY™ 0.80 mm Pitch Ultra High-Density Arrays
These ultra high density, high speed open-pin-field arrays feature a 0.80 mm pitch grid for up to 50% board space savings.
FAMILY OVERVIEW
These ultra high density, high speed open-pin-field arrays feature a 0.80 mm pitch grid for up to 50% board space savings compared to .050" pitch SEARAY™ interconnects. With up to 500 total Edge Rate® contacts optimized for signal integrity, this system allows for maximum grounding and routing flexibility. Features include up to 10 rows and 50 contacts per row, choice of 7 mm or 10 mm stack height, and high speed 28+ Gbps performance.
The socket is also available in right angle for micro backplane applications with optional guide posts for blind mating. Individual power modules with press fit tails provide a high power option for greater system flexibility.
FEATURES
- 0.80 mm (.0315") pitch grid
- 50% board space savings versus .050" (1.27 mm) pitch SEARAY™
- Performance: Up to 17.5 GHz / 35 Gbps
- Rugged Edge Rate® contact system
- Up to 500 I/Os
- 7 mm and 10 mm stack heights
- Solder charge terminations for ease of processing
- Samtec 28+ Gbps Solution
- Final Inch® certified for Break Out Region trace routing recommendations
SEAM8
0.80 mm SEARAY™ High-Speed High-Density Open-Pin-Field Array Terminal
Features
- 0.80 mm (.0315") pitch
- 50% board space savings versus .050" pitch SEARAY™
- Rugged Edge Rate® contact system
- 56 Gbps PAM4 performance
- SET Qualified Product: visit samtec.com/SET for more information about Severe Environment Testing
- Lower insertion/withdrawal forces
- Solder charge termination
- 7 mm and 10 mm stack heights
- Analog Over Array™ capable
SEAF8
0.80 mm SEARAY™ High-Speed High-Density Open-Pin-Field Array Socket
Features
- 0.80 mm (.0315") pitch
- 50% board space savings versus .050" pitch SEARAY™
- Rugged Edge Rate® contact system
- 56 Gbps PAM4 performance
- SET Qualified Product: visit samtec.com/SET for more information about Severe Environment Testing
- Lower insertion/withdrawal forces
- Solder charge termination
- 7 mm and 10 mm stack heights
- Analog Over Array™ capable
SEAF8-RA
0.80 mm SEARAY™ High-Speed High-Density Open-Pin-Field Array Socket, Right-Angle
Features
- High-density open-pin-field array
- Right-angle design
- 0.80 mm (.0315") pitch
- Rugged Edge Rate® contact
- 28 Gbps performance
- Lower insertion/withdrawal forces
- Solder charge termination
- Guide post option available
JSO
SureWare™ Jack Screw Precision Board Stacking Standoff
Features
- Works as a traditional standoff
- Assists with unmating LSHM, SEAM/SEAF, SEAM8/SEAF8, LPAM/LPAF, ADM6/ADF6 and other high-normal-force connectors
- Reduces risk for component damage on boards
- Board stacks from 4.00 mm to 16.00 mm
- Press-fit and threaded bases available
GPSK
SureWare™ Right-Angle Guide Post Socket
Features
- Accommodates blind mating in perpendicular applications
- Mates with GPPK Series guide post
- Use with PCB thickness of .062" (1.60 mm) to .125" (3.18 mm)
- Pairs with most high-speed connector strips and arrays
GPPK
SureWare™ Guide Post, Mates with GPSK
Features
- Accommodates blind mating in perpendicular applications
- Mates with GPSK guide post socket
- Pairs with most high-speed connector strips and arrays
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