Z-Ray® Ultra-Low Profile Arrays

Z-Ray® ultra-low profile, high-density one-piece arrays with compression contacts.


FAMILY OVERVIEW

As a high-speed, high-density connector, Z-Ray® provides the ultimate in design flexibility, from custom heights to full custom geometries. As an interposer, Z-Ray® is a cost-saving removable interface between the IC package and main board. Z-Ray® is ideal for the demands of military/defense, aerospace and R&D applications including radar, radio, navigation and sensors.

BeCu micro-formed contacts, on 0.80 mm and 1.00 mm pitches, are available in a variety of standard and custom configurations, as dual compression or single compression with solder balls. The contacts are assembled into rugged low-profile FR4 substrate under high pressure and temperature.

BeCu micro-formed contacts, on 0.80 mm and 1.00 mm pitches, are available in a variety of standard and custom configurations, and in dual compression and single compression/solder ball designs. The contacts are assembled into rugged low-profile FR4 substrate under high pressure and temperature.

FEATURES

Low Profile

High Density

  • Customer-specific pin counts for ultimate high density and speed flexibility
  • Choice of 0.80 mm or 1.00 mm pitch grid
  • Up to 400 I/Os standard with custom capabilities to 3,000+ I/Os
  • Also Available: 1.00 mm pitch system with up to 400 I/Os,1.27 mm and 2 mm standard heights, and up to 56 Gbps performance (GMI Series)

Flexible Designs

  • Configurations for any application, complete with detailed footprints
  • Dual compression or single compression with solder balls
  • Customer-specific stack heights, pin counts, insulator shapes, and plating thicknesses
  • Customizable in the X, Y, and Z axes
  • Wide variety of custom geometries
  • Quick-turn customization with minimal NRE and tooling charges
  • A variety of compression and alignment configurations available

Construction

Specifications

  • Performance up to 14 Gbps (ZA8, ZA1 Series) and 56 Gbps NRZ (ZA8H Series) with a migration path to 100 Gbps
  • Up to 1,000 cycles, with alternate contact design for up to 3,000 cycles also available (tested to 85˚C)
  • Low 30 g normal force with .008" contact deflection
  • 500 mA per line
  • Differential Vias™ PCB routing available
  • Also Available: 1.00 mm pitch system with up to 400 I/Os, 1.27 mm and 2 mm standard heights, and up to 56 Gbps performance
    (GMI Series)
  • Also Available: Ultra-low profile Z-Ray® Cable Assembly designed for high-speed, micro pitch applications (ZRDP Series)

Compression Hardware Systems

  • Engineered to provide precise alignment, compression and retention of dual compression (LGA) or single compression with solder balls (BGA) Z-Ray® Interposers
  • Z-Ray® hardware systems are ultra-low profile and designed to reduce risk of damage to the interposer
  • ZSO Series provides alignment for single compression solder ball interposers
  • ZHSI Series provides alignment and ensures proper contact retention for dual compression interposers
  • ZD Series press-in hardware provides proper PCB to interposer alignment for dual compression interposers

DOWNLOADS

Literature

Z-Ray<sup>®</sup> Interposer Application Design Guide

Z-Ray® Interposer Application Guide

Get
Compression Hardware e-brochure

Compression Hardware e-brochure

Get
High-Speed Board-to-Board Application Guide

High-Speed Board-to-Board Application Guide

Get

Technical Documents

SERIES

ZA8

0.80 mm Ultra Low Profile Micro Array

Features
  • Dual compression contacts or single compression with solder balls
  • Low profile - 1 mm standard height
  • Ideal for board stacking, module-to-board and LGA interfaces
  • Allows easy field upgrade, exchange
  • Minimizes thermal expansion issues
  • Up to 400 I/Os standard, with custom capabilities to 3,000+ I/Os
  • 0.80 mm (.0315") pitch
  • Performance up to 14 Gbps
0.80 mm Ultra Low Profile Micro Array

ZA1

1.00 mm Ultra Low Profile Micro Array

Features
  • Dual compression contacts or single compression with solder balls
  • Low profile - 1 mm standard height
  • Ideal for board stacking, module-to-board and LGA interfaces
  • Allows easy field upgrade, exchange
  • Minimizes thermal expansion issues
  • Up to 400 I/Os standard, with custom capabilities to 3,000+ I/Os
  • 1.00 mm (.0394") pitch
  • Performance up to 14 Gbps
1.00 mm Ultra Low Profile Micro Array

ZA8H

0.80 mm High-Speed Dual Compression Array

Features
  • Performance up to 56 Gbps NRZ
  • 0.33 mm height provides shortest signal path
  • Dual compression BeCu contacts
  • Up to 168 contacts: 4 or 7 rows with 3, 12 or 24 pairs per row
  • 30 g normal force with .008" (0.20 mm) contact deflection
0.80 mm High-Speed Dual Compression Array

ZSO

Z-Ray® Press-Fit Alignment Hardware

Features
  • Provides alignment for single-compression solder ball interposers
  • Prevents over compression of solder ball joints on interposer
  • Ensures proper contact retention and board spacing
  • Press-fit design
  • 1 mm board stack height (additional heights available; contact Samtec)
Z-Ray® Press-Fit Alignment Hardware

ZD

Z-Ray® Alignment Dowel

Features
  • Press-fit hardware provides proper PCB-to-interposer alignment for ZA8 and ZA1 Series
  • Micro 1 mm diameter
  • 3.7 mm, 5.3 mm and 5.7 mm lengths available for varying mated heights
  • Uses industry standard hardware to secure and compress the interposer
Z-Ray® Alignment Dowel

ZHSI

Z-Ray® Press-Fit Alignment Hardware

Features
  • Provides alignment and ensures proper contact retention for dual compression interposers
  • Prevents over compression of interposer contacts
  • Eliminates the need for additional fasteners
  • Press-fit design
  • Accommodates .062" and .093" PCB thickness
  • Max torque of 4 in-oz on the screw head
Z-Ray® Press-Fit Alignment Hardware

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