Z-Ray® Ultra-Low Profile Arrays

Z-Ray® ultra-low profile, high-density one-piece arrays with compression contacts.


FAMILY OVERVIEW

As a high-speed, high-density connector, Z-Ray® provides the ultimate in design flexibility, from custom heights to full custom geometries. As an interposer, Z-Ray® is a cost-saving removable interface between the IC package and main board. Z-Ray® is ideal for the demands of military/defense, aerospace and R&D applications including radar, radio, navigation and sensors.

BeCu micro-formed contacts, on 0.80 mm and 1.00 mm pitches, are available in a variety of standard and custom configurations, as dual compression or single compression with solder balls. The contacts are assembled into rugged low-profile FR4 substrate under high pressure and temperature.

BeCu micro-formed contacts, on 0.80 mm and 1.00 mm pitches, are available in a variety of standard and custom configurations, and in dual compression and single compression/solder ball designs. The contacts are assembled into rugged low-profile FR4 substrate under high pressure and temperature.

FEATURES

Low Profile

High Density

  • Customer-specific pin counts for ultimate high density and speed flexibility
  • Choice of 0.80 mm or 1.00 mm pitch grid
  • Up to 400 I/Os standard with custom capabilities to 3,000+ I/Os
  • Also Available: 1.00 mm pitch system with up to 400 I/Os,1.27 mm and 2 mm standard heights, and up to 56 Gbps performance (GMI Series)

Flexible Designs

  • Configurations for any application, complete with detailed footprints
  • Dual compression or single compression with solder balls
  • Customer-specific stack heights, pin counts, insulator shapes, and plating thicknesses
  • Customizable in the X, Y, and Z axes
  • Wide variety of custom geometries
  • Quick-turn customization with minimal NRE and tooling charges
  • A variety of compression and alignment configurations available

Construction

Specifications

  • Performance up to 14 Gbps (ZA8, ZA1 Series) and 56 Gbps NRZ (ZA8H Series) with a migration path to 100 Gbps
  • Up to 1,000 cycles, with alternate contact design for up to 3,000 cycles also available (tested to 85˚C)
  • Low 30 g normal force with .008" contact deflection
  • 500 mA per line
  • Differential Vias™ PCB routing available
  • Also Available: 1.00 mm pitch system with up to 400 I/Os, 1.27 mm and 2 mm standard heights, and up to 56 Gbps performance
    (GMI Series)
  • Also Available: Ultra-low profile Z-Ray® Cable Assembly designed for high-speed, micro pitch applications (ZRDP Series)

Compression Hardware Systems

  • Engineered to provide precise alignment, compression and retention of dual compression (LGA) or single compression with solder balls (BGA) Z-Ray® Interposers
  • Z-Ray® hardware systems are ultra-low profile and designed to reduce risk of damage to the interposer
  • ZSO Series provides alignment for single compression solder ball interposers
  • ZHSI Series provides alignment and ensures proper contact retention for dual compression interposers
  • ZD Series press-in hardware provides proper PCB to interposer alignment for dual compression interposers

DOWNLOADS

Literature

Z-Ray<sup>®</sup> Interposer Application Design Guide

Z-Ray® Interposer Application Guide

Get
Compression Hardware e-brochure

Compression Hardware e-brochure

Get
High-Speed Board-to-Board Application Guide

High-Speed Board-to-Board Application Guide

Get
Military/Aerospace Applications

Military/Aerospace Applications

Get

Technical Documents

SERIES

ZA8

0.80 mm Ultra Low Profile Micro Array

Features
  • Dual compression contacts or single compression with solder balls
  • Low profile - 1 mm standard height
  • Ideal for board stacking, module-to-board and LGA interfaces
  • Allows easy field upgrade, exchange
  • Minimizes thermal expansion issues
  • Up to 400 I/Os standard, with custom capabilities to 3,000+ I/Os
  • 0.80 mm (.0315") pitch
  • Performance up to 14 Gbps
0.80 mm Ultra Low Profile Micro Array

ZA1

1.00 mm Ultra Low Profile Micro Array

Features
  • Dual compression contacts or single compression with solder balls
  • Low profile - 1 mm standard height
  • Ideal for board stacking, module-to-board and LGA interfaces
  • Allows easy field upgrade, exchange
  • Minimizes thermal expansion issues
  • Up to 400 I/Os standard, with custom capabilities to 3,000+ I/Os
  • 1.00 mm (.0394") pitch
  • Performance up to 14 Gbps
1.00 mm Ultra Low Profile Micro Array

ZA8H

0.80 mm High-Speed Dual Compression Array

Features
  • Performance up to 56 Gbps NRZ
  • 0.33 mm height provides shortest signal path
  • Dual compression BeCu contacts
  • Up to 168 contacts: 4 or 7 rows with 3, 12 or 24 pairs per row
  • 30 g normal force with .008" (0.20 mm) contact deflection
0.80 mm High-Speed Dual Compression Array

ZSO

Z-Ray® Press-Fit Alignment Hardware

Features
  • Provides alignment for single-compression solder ball interposers
  • Prevents over compression of solder ball joints on interposer
  • Ensures proper contact retention and board spacing
  • Press-fit design
  • 1 mm board stack height (additional heights available; contact Samtec)
Z-Ray® Press-Fit Alignment Hardware

ZD

Z-Ray® Alignment Dowel

Features
  • Press-fit hardware provides proper PCB-to-interposer alignment for ZA8 and ZA1 Series
  • Micro 1 mm diameter
  • 3.7 mm, 5.3 mm and 5.7 mm lengths available for varying mated heights
  • Uses industry standard hardware to secure and compress the interposer
Z-Ray® Alignment Dowel

ZHSI

Z-Ray® Press-Fit Alignment Hardware

Features
  • Provides alignment and ensures proper contact retention for dual compression interposers
  • Prevents over compression of interposer contacts
  • Eliminates the need for additional fasteners
  • Press-fit design
  • Accommodates .062" and .093" PCB thickness
  • Max torque of 4 in-oz on the screw head
Z-Ray® Press-Fit Alignment Hardware

In November, we continued our mobile updates to the website, released a couple of new content experiences, and made placing sample requests even easier. Read more below on these and the rest of the major updates to Samtec.com for November 2018. Continued Improvements to our Mobil...
A joint demonstration between Samtec and eSilicon — an eSilicon 7 nm 56 Gbps DSP SerDes over a Samtec 5 meter ExaMAX® backplane cable assembly — caught a lot of attention at SC18. The demo showed a true long-reach capability with a high-performance, flexible, easy-to-configure Se...
Over the past few years, Samtec has expanded its portfolio of Characterization and Development Kits. Engineers and designers demand the best tools for system prototyping. From concept and prototype to development and production, Samtec-designed Characterization and Development Ki...
That’s shocking! Insulation Resistance and Dielectric Withstanding Voltage are two of the qualification tests that Samtec performs in-house during part qualification testing. These tests will ensure that when a connector is used in environmental conditions at the rated working vo...
As corporations worldwide become more mobile-friendly to their workforce, the Internet needs to evolve to match. This has been a huge trend in the B2C space for the last decade, and is now quickly catching up to the B2B space. We’ve seen our mobile user base grow rapidly in the p...