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triangle alert Our manufacturing capacity has been influenced by this pandemic, but our global operations team has been working tirelessly to maximize our output and minimize the impact to all our customers while prioritizing COVID-19 critical response applications. Some part numbers are experiencing delays, but many are not. You can access real-time lead times online within your account, chat, or call us anytime for the latest information. ×

Z-Ray® Ultra-Low Profile High-Density Arrays

Z-Ray® Ultra-Low Profile High-Density Arrays

Z-Ray® ultra-low profile, high-density one-piece arrays with compression contacts.


FAMILY OVERVIEW

zray video

As a high-speed, high-density connector, Z-Ray® provides the ultimate in design flexibility, from custom heights to full custom geometries. As an interposer, Z-Ray® is a cost-saving removable interface between the IC package and main board. Z-Ray® is ideal for the demands of military/defense, aerospace and R&D applications including radar, radio, navigation and sensors.

BeCu micro-formed contacts, on 0.80 mm and 1.00 mm pitches, are available in a variety of standard and custom configurations, as dual compression or single compression with solder balls. The contacts are assembled into rugged low-profile FR4 substrate under high pressure and temperature.

zray poster

BeCu micro-formed contacts, on 0.80 mm and 1.00 mm pitches, are available in a variety of standard and custom configurations, and in dual compression and single compression/solder ball designs. The contacts are assembled into rugged low-profile FR4 substrate under high pressure and temperature.

FEATURES

Low Profile

zray low profile

High Density

  • Customer-specific pin counts for ultimate high density and speed flexibility
  • Choice of 0.80 mm or 1.00 mm pitch grid
  • Up to 400 I/Os standard with custom capabilities to 3,000+ I/Os
  • Also Available: 1.00 mm pitch system with up to 400 I/Os,1.27 mm and 2 mm standard heights, and up to 56 Gbps performance (GMI Series)
zray high density

Flexible Designs

  • Configurations for any application, complete with detailed footprints
  • Dual compression or single compression with solder balls
  • Customer-specific stack heights, pin counts, insulator shapes, and plating thicknesses
  • Customizable in the X, Y, and Z axes
  • Wide variety of custom geometries
  • Quick-turn customization with minimal NRE and tooling charges
  • A variety of compression and alignment configurations available
zray flexible

Construction

zray construction

Specifications

  • Performance up to 14 Gbps (ZA8, ZA1 Series) and 56 Gbps NRZ (ZA8H Series) with a migration path to 100 Gbps
  • Up to 1,000 cycles, with alternate contact design for up to 3,000 cycles also available (tested to 85˚C)
  • Low 30 g normal force with .008" contact deflection
  • 500 mA per line
  • Differential Vias™ PCB routing available
  • Also Available: 1.00 mm pitch system with up to 400 I/Os, 1.27 mm and 2 mm standard heights, and up to 56 Gbps performance
    (GMI Series)
  • Also Available: Ultra-low profile Z-Ray® Cable Assembly designed for high-speed, micro pitch applications (ZRDP Series)
zray specifications

Compression Hardware Systems

  • Engineered to provide precise alignment, compression and retention of dual compression (LGA) or single compression with solder balls (BGA) Z-Ray® Interposers
  • Z-Ray® hardware systems are ultra-low profile and designed to reduce risk of damage to the interposer
  • ZSO Series provides alignment for single compression solder ball interposers
  • ZHSI Series provides alignment and ensures proper contact retention for dual compression interposers
  • ZD Series press-in hardware provides proper PCB to interposer alignment for dual compression interposers
zray hardware

DOWNLOADS

Literature

Z-Ray<sup>®</sup> Interposer Application Design Guide

Z-Ray® Interposer Application Guide

Get
Compression Hardware e-brochure

Compression Hardware e-brochure

Get
High-Speed Board-to-Board Application Guide

High-Speed Board-to-Board Application Guide

Get
Military/Aerospace Applications

Military/Aerospace Applications

Get

Technical Documents

VIDEOS

Z-Ray® Compression Hardware

SERIES

ZA1

1.00 mm Ultra-Low Profile Compression Interposer

Features
  • Dual compression contacts or single compression with solder balls
  • Low profile - 1 mm standard height
  • Ideal for board stacking, module-to-board and LGA interfaces
  • Allows easy field upgrade, exchange
  • Minimizes thermal expansion issues
  • Up to 400 I/Os standard, with custom capabilities to 3,000+ I/Os
  • 1.00 mm (.0394") pitch
  • Performance up to 14 Gbps
1.00 mm Ultra-Low Profile Compression Interposer

ZA8

0.80 mm Ultra-Low Profile Compression Interposer

Features
  • Dual compression contacts or single compression with solder balls
  • Low profile - 1 mm standard height
  • Ideal for board stacking, module-to-board and LGA interfaces
  • Allows easy field upgrade, exchange
  • Minimizes thermal expansion issues
  • Up to 400 I/Os standard, with custom capabilities to 3,000+ I/Os
  • 0.80 mm (.0315") pitch
  • Performance up to 14 Gbps
0.80 mm Ultra-Low Profile Compression Interposer

ZA8H

0.80 mm High-Speed Dual Compression Interposer

Features
  • Performance up to 56 Gbps NRZ
  • 0.33 mm height provides shortest signal path
  • Dual compression BeCu contacts
  • Up to 168 contacts: 4 or 7 rows with 3, 12 or 24 pairs per row
  • 30 g normal force with .008" (0.20 mm) contact deflection
0.80 mm High-Speed Dual Compression Interposer

ZSO

Z-Ray® Press-Fit Alignment Hardware

Features
  • Provides alignment for single-compression solder ball interposers
  • Prevents over compression of solder ball joints on interposer
  • Ensures proper contact retention and board spacing
  • Press-fit design
  • 1 mm board stack height (additional heights available; contact Samtec)
Z-Ray® Press-Fit Alignment Hardware

ZD

Z-Ray® Alignment Dowel

Features
  • Press-fit hardware provides proper PCB-to-interposer alignment for ZA8 and ZA1 Series
  • Micro 1 mm diameter
  • 3.7 mm, 5.3 mm and 5.7 mm lengths available for varying mated heights
  • Uses industry standard hardware to secure and compress the interposer
Z-Ray® Alignment Dowel

ZHSI

Z-Ray® Press-Fit Alignment Hardware

Features
  • Provides alignment and ensures proper contact retention for dual compression interposers
  • Prevents over compression of interposer contacts
  • Eliminates the need for additional fasteners
  • Press-fit design
  • Accommodates .062" and .093" PCB thickness
  • Max torque of 4 in-oz on the screw head
Z-Ray® Press-Fit Alignment Hardware

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