AcceleRate® HD Ultra-Dense Multi-Row Mezzanine Strips

AcceleRate® HD ultra-dense, multi-row mezzanine strips are rated for 56 Gbps PAM4 on a 0.635 mm pitch.


FAMILY OVERVIEW

AcceleRate® HD features high-speed Edge Rate® contacts designed for high-speed, high-cycle applications.

The surface of the contact is milled creating a smooth mating surface, which reduces wear on the contact increasing durability and cycle life. Also, lower insertion and withdrawal forces allow zippered unmating.

FEATURES

  • Incredibly dense with up to 240 total I/Os
  • Low profile 5 mm stack height
  • Slim 5 mm width
  • 4-row design; 10 - 60 positions per row (40 - 240 total positions)
  • Edge Rate® contact system optimized for signal integrity performance
  • Supports 56 Gbps PAM4 (28 Gbps NRZ) applications
  • Solder ball technology for simplified processing and self aligning
  • Additional stack heights and higher pin counts in development

DOWNLOADS

Literature

AcceleRate® HD eBrochure

AcceleRate® HD eBrochure

Get
High-Speed Board-to-Board Application Guide

High-Speed Board-to-Board Application Guide

Get
Broadcast Video Solutions Guide

Broadcast Video Solutions Guide

Get
Product Overview Guide

Product Overview Guide

Get

SERIES

ADM6

0.635 mm AcceleRate® HD High-Density 4-Row Header

Features
  • Incredibly dense with up to 240 total I/Os
  • Low profile 5 mm stack height and slim 5 mm width
  • 4-row design; 10 - 60 positions per row (40 - 240 total positions)
  • Edge Rate® contact system optimized for signal integrity performance
  • Supports 56 Gbps PAM4 (28 Gbps NRZ) applications
  • Solder ball technology for simplified processing and self aligning
  • Additional stack heights and higher pin counts in development
0.635 mm AcceleRate® HD High-Density 4-Row Header

ADF6

0.635 mm AcceleRate® HD High-Density 4-Row Socket

Features
  • Incredibly dense with up to 240 total I/Os
  • Low profile 5 mm stack height and slim 5 mm width
  • 4-row design; 10 - 60 positions per row (40 - 240 total positions)
  • Edge Rate® contact system optimized for signal integrity performance
  • Supports 56 Gbps PAM4 (28 Gbps NRZ) applications
  • Solder ball technology for simplified processing and self aligning
  • Additional stack heights and higher pin counts in development
0.635 mm AcceleRate® HD High-Density 4-Row Socket

Samtec is presenting new products and new technologies at Electronica 2018, as well as our full line of interconnects including High Speed Board-to-Board, High Speed Cable Assemblies, Micro/Rugged, Flexible Stacking, Optics and Precision RF.  We are in a new location this year:  ...
Next-generation high-performance copper and optical interconnects must solve multiple technical challenges including higher data rates, increased system and chassis density, and improved signal integrity. Samtec’s diverse product and technology portfolio provides system designers...
One of the things we’re most proud of about Samtec.com is the wide array of technical documentation and resources that are available to all users, without even logging in. While this is a huge benefit to our users, it’s also a huge challenge to organize and deliever all of this i...
When it comes to the Military / Aerospace industries, you probably think of products that are rugged and meant to take abuse. The products used in these industries are required to operate and last in extreme environments, and product testing is as important as the product itself....
Embedded vision systems are commonplace in everyday applications. As an example, ADAS systems in modern automobiles increase driver and passenger safety. In another application, visual inspection systems reduce manufacturing errors on the production line. Additionally, drones are...