SEARAY™ 0.80 mm Pitch Ultra High-Density Arrays

SEARAY™ 0.80 mm Pitch Ultra High-Density Arrays

These ultra high density, high speed open-pin-field arrays feature a 0.80 mm pitch grid for up to 50% board space savings.


FAMILY OVERVIEW

searayultralp video

These ultra high density, high speed open-pin-field arrays feature a 0.80 mm pitch grid for up to 50% board space savings compared to .050" pitch SEARAY™ interconnects. With up to 500 total Edge Rate® contacts optimized for signal integrity, this system allows for maximum grounding and routing flexibility. Features include up to 10 rows and 50 contacts per row, choice of 7 mm or 10 mm stack height, and high speed 28+ Gbps performance.

The socket is also available in right angle for micro backplane applications with optional guide posts for blind mating. Individual power modules with press fit tails provide a high power option for greater system flexibility.

searay ultralp poster

The socket is also available in right angle for micro backplane applications with optional guide posts for blind mating. Individual power modules with press fit tails provide a high power option for greater system flexibility.

FEATURES

  • 0.80 mm (.0315") pitch grid
  • 50% board space savings versus .050" (1.27 mm) pitch SEARAY™
  • Performance: Up to 17.5 GHz / 35 Gbps
  • Rugged Edge Rate® contact system
  • Up to 500 I/Os
  • 7 mm and 10 mm stack heights
  • Solder charge terminations for ease of processing
  • Samtec 28+ Gbps Solution
  • Final Inch® certified for Break Out Region trace routing recommendations (Patent pending)
open-pin-field Flexibility

DOWNLOADS

Literature

SEARAY™ eBrochure

SEARAY™ 0.80 eBrochure

Get
Micro Rugged Application Design Guide

Micro Rugged Application Design Guide

Get
Broadcast Video Solutions Guide

Broadcast Video Solutions Guide

Get
High-Speed Board-to-Board Application Guide

High-Speed Board-to-Board Application Guide

Get

VIDEOS

Jack Screw Standoffs for High-Normal-Force Applications (JSO & JSOM)

Samtec Advanced Interconnect Design Tech Center

SEARAY™ High Density Arrays

SERIES

SEAM8

0.80 mm SEARAY™ High-Speed High-Density Open-Pin-Field Array Terminal

Features
  • 0.80 mm (.0315") pitch
  • 50% board space savings versus .050" pitch SEARAY™
  • Rugged Edge Rate® contact system
  • 56 Gbps PAM4 performance
  • Lower insertion/withdrawal forces
  • Solder charge termination
  • 7 mm and 10 mm stack heights
  • Final Inch® patent pending
0.80 mm SEARAY™ High-Speed High-Density Open-Pin-Field Array Terminal

SEAF8

0.80 mm SEARAY™ High-Speed High-Density Open-Pin-Field Array Socket

Features
  • 0.80 mm (.0315") pitch
  • 50% board space savings versus .050" pitch SEARAY™
  • Rugged Edge Rate® contact system
  • 56 Gbps PAM4 performance
  • Lower insertion/withdrawal forces
  • Solder charge termination
  • 7 mm and 10 mm stack heights
  • Final Inch® patent pending
0.80 mm SEARAY™ High-Speed High-Density Open-Pin-Field Array Socket

SEAF8-RA

0.80 mm SEARAY™ High-Speed High-Density Open-Pin-Field Array Socket, Right-Angle

Features
  • High-density open-pin-field array
  • Right-angle design
  • 0.80 mm (.0315") pitch
  • Rugged Edge Rate® contact
  • 28 Gbps performance
  • Lower insertion/withdrawal forces
  • Solder charge termination
  • Guide post option available
0.80 mm SEARAY™ High-Speed High-Density Open-Pin-Field Array Socket, Right-Angle

JSO

Jack Screw Precision Board Stacking Standoff

Features
  • Works as a traditional standoff
  • Assists with unmating LSHM, SEAM/SEAF, SEAM8/SEAF8, LPAM/LPAF and other high-normal-force connectors
  • Reduces risk for component damage on boards
  • Board stacks from 4.00 mm to 16.00 mm
  • Press-fit and threaded bases available
Jack Screw Precision Board Stacking Standoff

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