SEARAY™ 0.80 mm Pitch Ultra High-Density Arrays

These ultra high density, high speed open pin field arrays feature a 0.80 mm pitch grid for up to 50% board space savings.


FAMILY OVERVIEW

These ultra high density, high speed open pin field arrays feature a 0.80 mm pitch grid for up to 50% board space savings compared to .050" pitch SEARAY™ interconnects. With up to 500 total Edge Rate® contacts optimized for signal integrity, this system allows for maximum grounding and routing flexibility. Features include up to 10 rows and 50 contacts per row, choice of 7 mm or 10 mm stack height, and high speed 28+ Gbps performance.

The socket is also available in right angle for micro backplane applications with optional guide posts for blind mating. Individual power modules with press fit tails provide a high power option for greater system flexibility.

The socket is also available in right angle for micro backplane applications with optional guide posts for blind mating. Individual power modules with press fit tails provide a high power option for greater system flexibility.

FEATURES

  • 0.80 mm (.0315") pitch grid
  • 50% board space savings versus .050" (1.27 mm) pitch SEARAY™
  • Performance: Up to 17.5 GHz / 35 Gbps
  • Rugged Edge Rate® contact system
  • Up to 500 I/Os
  • 7 mm and 10 mm stack heights
  • Solder charge terminations for ease of processing
  • Samtec 28+ Gbps Solution
  • Final Inch® certified for Break Out Region trace routing recommendations (Patent pending)
Open Pin Field Flexibility

DOWNLOADS

Literature

SEARAY™ eBrochure

SEARAY™ 0.80 eBrochure

Get
Micro Rugged Application Design Guide

Micro Rugged Application Design Guide

Get
Broadcast Video Solutions Guide

Broadcast Video Solutions Guide

Get
High-Speed Board-to-Board Application Guide

High-Speed Board-to-Board Application Guide

Get

SERIES

JSO

Jack Screw Precision Board Stacking Standoff

Features
  • Works as a traditional standoff
  • Assists with unmating LSHM, SEAM/SEAF, SEAM8/SEAF8, LPAM/LPAF and other high-normal-force connectors
  • Reduces risk for component damage on boards
  • Board stacks from 4.00 mm to 16.00 mm
  • Press-fit and threaded bases available
Jack Screw Precision Board Stacking Standoff

SEAF8

0.80 mm SEARAY™ High-Speed High-Density Open-Pin-Field Array Socket

Features
  • 0.80 mm (.0315") pitch
  • 50% board space savings versus .050" pitch SEARAY™
  • Rugged Edge Rate® contact system
  • Lower insertion/withdrawal forces
  • Solder charge termination
  • 7 mm and 10 mm stack heights
  • Final Inch® patent pending
  • Samtec 28+ Gbps Solution
0.80 mm SEARAY™ High-Speed High-Density Open-Pin-Field Array Socket

SEAF8-RA

0.80 mm SEARAY™ High-Speed High-Density Open-Pin-Field Array Socket, Right-Angle

Features
  • High-density open-pin-field array
  • Right-angle design
  • 0.80 mm (.0315") pitch
  • Rugged Edge Rate® contact
  • Lower insertion/withdrawal forces
  • Solder charge termination
  • Guide post option available
0.80 mm SEARAY™ High-Speed High-Density Open-Pin-Field Array Socket, Right-Angle

SEAM8

0.80 mm SEARAY™ High-Speed High-Density Open-Pin-Field Array Terminal

Features
  • 0.80 mm (.0315") pitch
  • 50% board space savings versus .050" pitch SEARAY™
  • Rugged Edge Rate® contact system
  • Lower insertion/withdrawal forces
  • Solder charge termination
  • 7 mm and 10 mm stack heights
  • Final Inch® patent pending
  • Samtec 28+ Gbps Solution
0.80 mm SEARAY™ High-Speed High-Density Open-Pin-Field Array Terminal

UBPS

1.50 mm SEARAY™ Socket Power Module

Features
1.50 mm SEARAY™ Socket Power Module

UBPT

1.50 mm SEARAY™ Terminal Power Module

Features
1.50 mm SEARAY™ Terminal Power Module

Samtec has the largest and most flexible product offering of two-piece board stacking connector systems in the industry. We have more ways to stack two or more boards together than any other connector company. But the sheer number of options can make it difficult to find the righ...
Samtec proudly announces its participation this the ST Developers Conference 2017. This FREE one-day interactive summit will bring together experts in markets that are poised for rapid growth in the coming years: Smart Things for the IoT, Smart Driving, and Smart Home, City & Ind...
Samtec high-speed, edge card interconnect systems are available in a variety of pitches, stack heights, and orientations. They are used just about everywhere, including computers and peripherals, telecom, datacom, industrial equipment, medical, test and measurement, instrumentati...
With our last web update, we brought you a new way to export your data from our Solutionator parametric search tool, several updates to key support pages on the website, and our latest installment of product literature, our High Speed Board-to-Board Guide. This month, we’re very ...
High-speed PCB design for applications supporting data rates of 28 Gbps and beyond provides many challenges.  PCB designers and layout engineers need to answer many questions: What PCB laminate offers the best performance? What connectors will be used?  What is the stack up?  How...
View Full Site