Ultra Micro

Ultra-fine pitch, ultra-low profile and ultra-slim body interconnects with 28+ Gbps performance.


Razor Beam™ LPRazor Beam™ LP

Ultra slim, ultra low profile and ultra fine pitch interconnects.

Features
  • Ultra fine pitch – 0.40 mm and 0.50 mm
  • Ultra low stack down to 2.00 mm
  • Slim body design for increased board space savings
Series
V
  • SLH
  • SS4
  • SS5
  • ST4
  • ST5
  • TLH
Help Me Choose?
Razor Beam™ LP

Edge Rate® High-DensityEdge Rate® High-Density Multi-Row Mezzanine Strips

Samtec’s 0.635 mm pitch high-density multi-row mezzanine strips feature up to 240 signal integrity optimized Edge Rate® contacts in a low profile, slim body design.

Features
  • Incredibly dense with up to 240 total I/Os
  • Low profile 5 mm stack height and slim 5 mm width
  • 4-row design; 10 - 60 positions per row (40 - 240 total positions)
  • Edge Rate® contact systems optimized for signal integrity performance
  • Supports 28+ Gbps applications
  • Solder ball technology for simplified processing
  • Even thinner 2-row version and additional stack heights in development
Series
V
  • EDF6
  • EDM6
Edge Rate® High-Density

Edge Rate®Edge Rate® Connector Strips

Rugged Edge Rate® contact systems optimized for signal integrity performance.

Features
  • Edge Rate® contacts optimized for signal integrity performance
  • Robust when "zippered" during unmating
  • 0.80 mm or 0.50 mm pitch systems
  • Stack heights from 7 mm to 16 mm
  • 0.50 mm pitch system for up to 40% PCB space savings
Series
V
  • ERF5
  • ERF5-RA
  • ERF8
  • ERF8-EM
  • ERF8-RA
  • ERM5
  • ERM8
  • ERM8-EM
  • ERM8-RA
Edge Rate®

Razor Beam™Razor Beam™

High-speed, high-density Razor Beam™ self-mating systems reduce inventory costs and are available in a variety of pitches and lead styles for increased flexibility.

Features
  • 10 stack height options from 5 mm to 12 mm
  • Audible click when mated
  • Mating and unmating forces approximately 4-6x greater than typical micro pitch connectors
  • Up to 100 contacts
Series
V
  • JSO
  • LSEM
  • LSHM
  • LSS
Razor Beam™

Z-Ray® Ultra-Low Profile ArraysZ-Ray® Ultra-Low Profile Arrays

Z-Ray® ultra-low profile, high-density one-piece arrays with compression contacts.

Features
  • 1 mm standard body height
  • Dual compression contacts
  • Single compression with solder ball
  • Performance up to 20 GHz / 40 Gbps
  • 0.80 mm or 1.00 mm pitch standard
  • Highly customizable system
Series
V
  • ZA1
  • ZA8
  • ZA8H
  • ZD
  • ZHSI
  • ZSO
Z-Ray® Ultra-Low Profile Arrays

SEARAY™ 0.80 mmSEARAY™ 0.80 mm Pitch Ultra High-Density Arrays

These ultra high-density, high-speed open pin field arrays feature a 0.80 mm pitch for up to 50% board space savings.

Features
  • 0.80 mm (.0315") pitch grid
  • 50% board space savings versus .050" (1.27 mm) pitch SEARAY™
  • Performance: Up to 17.5 GHz / 35 Gbps
  • Rugged Edge Rate® contact system
  • Up to 500 I/Os
  • 7 mm and 10 mm stack heights
  • Solder charge terminations for ease of processing
  • Samtec 28+ Gbps Solution
  • Final Inch® certified for Break Out Region trace routing recommendations (patent pending)
Series
V
  • JSO
  • SEAF8
  • SEAF8-RA
  • SEAM8
  • UBPS
  • UBPT
SEARAY™ 0.80 mm

LP Array™LP Array™ Low Profile Open-Pin-Field Arrays

Low profile open-pin-field arrays down to 4 mm stack height and up to 320 total I/Os.

Features
  • 4 mm, 4.5 mm, 5 mm stack heights
  • Up to 320 I/Os
  • 4, 6 and 8 row designs
  • .050" (1.27 mm) pitch
  • Dual beam contact system
  • Solder crimp termination for ease of processing
  • Performance up to 18.5 GHz / 37 Gbps
Series
V
  • JSO
  • LPAF
  • LPAM
LP Array™

The 28 Gbps Product Demonstrator is an active system that showcases Samtec interconnect products at 28 Gbps and beyond. In this brief video overview, Scott McMorrow, Samtec’s CTO of Signal Integrity Products, and Brian Vicich, VP of Engineering, explain that it was designed to sh...
One of the largest differentiators of Samtec.com is its incredible variety of technical documentation, the vast majority of which is available without even logging in. While this level of availability is great for users, because of the sheer amount of documentation available, it ...
System designers and engineers constantly face design challenges to achieve higher data-rates in highly dense applications.  A popular system-level design approach in many high-speed applications marries the configurability and high-speed performance of FPGAs with the advantages ...
Samtec has the largest and most flexible product offering of two-piece board stacking connector systems in the industry. We have more ways to stack two or more boards together than any other connector company. But the sheer number of options can make it difficult to find the righ...
Samtec proudly announces its participation this the ST Developers Conference 2017. This FREE one-day interactive summit will bring together experts in markets that are poised for rapid growth in the coming years: Smart Things for the IoT, Smart Driving, and Smart Home, City & Ind...
View Full Site