Power/Signal Systems

High power/signal combination board-to-board systems up to 60 A, in vertical and right-angle orientations with high-density power blades and small form factor designs.


Signal/Power Edge Rate® ComboSignal/Power Edge Rate® Combo Edge Card System

Combination signal and power edge card system with rugged Edge Rate® contacts and performance up to 60 A per power bank.

Features
  • Power blades rated up to 60 A per power bank
  • Rugged Edge Rate® contact system
  • Accepts 1.60mm (.062") thick cards
  • Available with 40, 60 and 80 signal pins
  • Choice of 2 or 4 power banks
  • Optional weld tab for mechanical strength
Series
V
  • HSEC8-PV
Signal/Power Edge Rate® Combo

Power / Q2™ Signal ComboPower / Q2™ Signal Combo

Q2™ power and signal combination interconnects with integral ground plane.

Features
  • Current Rating: 2.7A per power pin
  • High-speed Q2™ contacts with power end option
  • Vertical and right-angle orientations
  • Up to 8 power pins per end as an application specific option
  • Optional shielding
  • Stack Height: 10.00 mm and 11.00 mm
  • Contacts: Up to 156 signals, up to 4 power per end
Series
V
  • QFS
  • QMS
  • HPMC
  • HPFC
  • PCT2
  • PCS2
Power / Q2™ Signal Combo

PowerStrip™PowerStrip™

PowerStrip™/30 and PowerStrip™/40 combination signal and power systems.

Features
  • Performance up to 31.4 A per power blade
  • Up to 8 power blades and 80 signal pins
  • High-power dual blade contact system
  • Rugged screw down and locking clip options
Series
V
  • PESC
  • PETC
  • MPSC
  • MPTC
PowerStrip™

mPOWER™ Ultra Micro Power ConnectorsmPOWER™ Ultra Micro Power Connectors

Micro 2.00 mm pitch power blade interconnects designed for staging a combination power and signal/ground solution.

Features
  • Design flexibility as a power-only system or a two-piece system for power/signal applications
  • Use with Samtec’s high-speed connector systems for a power/signal solution
  • 5 mm to 16 mm stack heights
  • Up to 21 A per blade
  • 2 – 5 power blades on a 2.00 mm pitch
Series
V
  • UMPT
  • UMPS
mPOWER™ Ultra Micro Power Connectors

EXTreme Ten60Power™EXTreme Ten60Power™

A 60 Amp modular high power and signal combo connector system for coplanar and right-angle board-to-board applications. Designed as a high-current and lower profile interconnect than existing connectors, EXTreme Ten60Power™ interconnects provide maximum current-to-length ratio packaged in a low 10 mm height housing that enhances airflow within the system.

Features
  • Performance up to 60 A per power blade
  • Rugged 10 mm low profile design (right-angle orientation)
  • 3 or 5 signal rows in the same form factor
  • Available with 0 to 40 signal pins
  • Up to 20 total DC power blades or 12 total AC power blades
  • AC-DC power combos and split power options available
  • Press-fit tails option for ease of board termination (ET60S only)
  • Modules can be configured to accommodate most any design
  • For coplanar or perpendicular applications
  • Hot plug option available
  • Dual sourced by Molex®
Series
V
  • ET60S
  • ET60T
EXTreme Ten60Power™

EXTreme LPHPower™EXTreme LPHPower™

High-power, low profile system.

Features
  • Performance up to 30 A per power blade
  • Extremely low 7.50 mm profile (right-angle)
  • Double stacked power blades for high-density
  • Socket mates with standard .062" (1.60 mm) PCB card
Series
V
  • LPHS
  • LPHT
EXTreme LPHPower™

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