Power/Signal Systems

High power and signal connectors. Combination board-to-board systems up to 60 A, in vertical and right-angle orientations with high-density power blades and small form factor designs.


Signal/Power Edge Rate® ComboSignal/Power Edge Rate® Combo Edge Card System

Combination signal and power edge card system with rugged Edge Rate® contacts and performance up to 60 A per power bank.

Features
  • Power blades rated up to 60 A per power bank
  • Rugged Edge Rate® contact system
  • Accepts 1.60mm (.062") thick cards
  • Available with 40, 60 and 80 signal pins
  • Choice of 2 or 4 power banks
  • Optional weld tab for mechanical strength
Products
V
  • HSEC8-PV
Signal/Power Edge Rate® Combo

Power / Q2™ Signal ComboPower / Q2™ Signal Combo

Q2™ power and signal combination interconnects with integral ground plane.

Features
  • High-speed Q2™ contacts with power end option
  • Vertical and right-angle orientations
  • Up to 8 power pins per end as an application specific option
  • Optional shielding
  • Stack Height: 10.00 mm and 11.00 mm
  • Contacts: Up to 156 signals, up to 4 power per end
Products
V
  • QFS
  • QMS
  • GPSK
  • GPPK
  • HPFC
  • HPMC
  • PCS2
  • PCT2
Power / Q2™ Signal Combo

PowerStrip™PowerStrip™

PowerStrip™/30 and PowerStrip™/40 combination signal and power systems.

Features
  • Performance to 31.4 A per power blade
  • Up to 8 power blades and 80 signal pins
  • High-power dual blade contact system
  • Rugged screw down and locking clip options
Products
V
  • PESC
  • PETC
  • MPSC
  • MPTC
PowerStrip™

AcceleRate® mPAcceleRate® mP High-Density, High-Speed Power/Signal Arrays

These 0.635 mm pitch power/signal arrays achieve 64 Gbps PAM4 speeds and feature rotated power blades for 22 Amps/blade and simplified breakout region (BOR). View the full line of AcceleRate® products.

Features
  • Best in class density for power and signal
  • Power blades rotated 90º gives equal access to heat escape for uniform cooling, increased current capacity and reduced crowding
  • Supports 64 Gbps PAM4 (32 Gbps NRZ) applications
  • PCIe® 6.0/CXL® 3.1 capable
  • Up to 22 Amps per power blade
  • Open-pin-field for grounding and routing flexibility
  • High-density multi-row design
  • Low profile 5 mm stack height; up to 16 mm in development
  • 4 or 8 total power blades; up to 10 in development
  • 60 or 240 total signal positions; additional position counts in development
  • 0.635 mm signal pitch
  • Optional alignment pins and weld tabs for a secure connection to the board
  • Polarized guide posts for blind mating
  • View the full line of AcceleRate® products
Products
V
  • UDF6
  • UDM6
AcceleRate® mP

EXTreme Ten60Power™EXTreme Ten60Power™

A 60 Amp modular high power and signal combo connector system for coplanar and right-angle board-to-board applications. Designed as a high-current and lower profile interconnect than existing connectors, EXTreme Ten60Power™ interconnects provide maximum current-to-length ratio packaged in a low 10 mm height housing that enhances airflow within the system.

Features
  • Performance to 60 A per power blade
  • Rugged 10 mm low profile design (right-angle orientation)
  • 3 or 5 signal rows in the same form factor
  • Available with 0 to 40 signal pins
  • Up to 20 total DC power blades or 12 total AC power blades
  • AC-DC power combos and split power options available
  • Press-fit tails option for ease of board termination (ET60S only)
  • Modules can be configured to accommodate most any design
  • For coplanar or perpendicular applications
  • Hot plug option available
Products
V
  • ET60S
  • ET60T
EXTreme Ten60Power™

EXTreme LPHPower™EXTreme LPHPower™

High-power, low profile system.

Features
  • Performance to 30 A per power blade
  • Extremely low 7.50 mm profile (right-angle)
  • Double stacked power blades for high-density
  • Socket mates with standard .062" (1.60 mm) PCB card
Products
V
  • LPHS
  • LPHT
EXTreme LPHPower™

ExaMAX®ExaMAX® High-Speed Backplane System

ExaMAX® high-speed backplane interconnects deliver 64 Gbps PAM4 (32 Gbps NRZ) electrical performance.

Features
  • Enables 64 Gbps PAM4 (32 Gbps NRZ) electrical performance on 2.00 mm column pitch
  • PCIe® 6.0/CXL® 3.1 capable
  • Allows designers to optimize density or minimize board layer count
  • Two reliable points of contact, even when subjected to angled mating
  • Meets Telcordia GR-1217 CORE specification
  • Individual signal wafers with staggered differential pair design; 24 - 72 pairs (board connectors) and 16 - 96 pairs (cable assemblies)
  • One-piece embossed ground structure on each signal wafer to reduce crosstalk
  • Lowest mating force on the market: 0.36 N max per contact
  • Backplane cable assemblies improve signal integrity and increase signal path length at higher data rates
  • Samtec’s Eye Speed® ultra low skew twinax cable provides increased flexibility and routability
  • Stub free mating
  • Press-fit termination
  • Power and Guide Modules available
Products
V
  • EBTM
  • EBTM-RA
  • EBTF-RA
  • EBDM-RA
  • EBCM
  • EBCF
  • EGBM
  • EGBF
  • EPTT
  • EPTS
  • EBCL
  • EBCB
ExaMAX®

XCede® HDXCede® HD High-Density Backplane System

Small form factor high-density backplane system ideal for density-critical applications, with a modular design and optional features for flexibility and customizable solutions.

Features
  • Small form factor provides significant space savings
  • Modular design provides flexibility in applications
  • High-performance system
  • High-density backplane system – up to 84 differential pairs per linear inch
  • 1.80 mm column pitch
  • 3-, 4- and 6-pair designs
  • 4, 6 or 8 columns
  • 12 - 48 pairs
  • Multiple signal/ground pin staging options
  • Integrated power, guidance, keying and side walls available
  • 85 Ω and 100 Ω options
  • Three levels of sequencing enable hot plugging
  • Cost-effective designs available for low-speed applications
Products
V
  • HDTF
  • HDTM
  • BSP
  • HPTS
  • HPTT
XCede® HD

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