Power/Signal Systems

High power/signal combination board-to-board systems up to 60 A, in vertical and right-angle orientations with high-density power blades and small form factor designs.


Signal/Power Edge Rate® ComboSignal/Power Edge Rate® Combo Edge Card System

Combination signal and power edge card system with rugged Edge Rate® contacts and performance up to 60 A per power bank.

Features
  • Power blades rated up to 60 A per power bank
  • Rugged Edge Rate® contact system
  • Accepts 1.60mm (.062") thick cards
  • Available with 40, 60 and 80 signal pins
  • Choice of 2 or 4 power banks
  • Optional weld tab for mechanical strength
Series
V
  • HSEC8-PV
Signal/Power Edge Rate® Combo

Power / Q2™ Signal ComboPower / Q2™ Signal Combo

Q2™ power and signal combination interconnects with integral ground plane.

Features
  • Current Rating: 2.7A per power pin
  • High-speed Q2™ contacts with power end option
  • Vertical and right-angle orientations
  • Up to 8 power pins per end as an application specific option
  • Optional shielding
  • Stack Height: 10.00 mm and 11.00 mm
  • Contacts: Up to 156 signals, up to 4 power per end
Series
V
  • HPFC
  • HPMC
  • PCS2
  • PCT2
  • QFS
  • QMS
Power / Q2™ Signal Combo

PowerStrip™PowerStrip™

PowerStrip™/30 and PowerStrip™/40 combination signal and power systems.

Features
  • Performance up to 31.4 A per power blade
  • Up to 8 power blades and 80 signal pins
  • High-power dual blade contact system
  • Rugged screw down and locking clip options
Series
V
  • MPSC
  • MPTC
  • PESC
  • PETC
PowerStrip™

EXTreme Ten60Power™EXTreme Ten60Power™

A 60 Amp modular high power and signal combo connector system for coplanar and right-angle board-to-board applications. Designed as a high-current and lower profile interconnect than existing connectors, EXTreme Ten60Power™ interconnects provide maximum current-to-length ratio packaged in a low 10 mm height housing that enhances airflow within the system.

Features
  • Performance up to 60 A per power blade
  • Rugged 10 mm low profile design (right-angle orientation)
  • 3 or 5 signal rows in the same form factor
  • Available with 0 to 40 signal pins
  • Up to 20 total DC power blades or 12 total AC power blades
  • AC-DC power combos and split power options available
  • Press-fit tails option for ease of board termination (ET60S only)
  • Modules can be configured to accommodate most any design
  • For coplanar or perpendicular applications
  • Hot plug option available
  • Dual sourced by Molex®
Series
V
  • ET60S
  • ET60T
EXTreme Ten60Power™

EXTreme LPHPower™EXTreme LPHPower™

High-power, low profile system.

Features
  • Performance up to 30 A per power blade
  • Extremely low 7.50 mm profile (right-angle)
  • Double stacked power blades for high-density
  • Socket mates with standard .062" (1.60 mm) PCB card
Series
V
  • LPHS
  • LPHT
EXTreme LPHPower™

The North American Broadcast Show, or NAB, is April 22-27 at the Las Vegas Convention Center.  NAB is about everything digital in the fields of media, entertainment, and technology. Samtec is exhibiting its line of 12G SDI RF interconnects, including a product demonstration showi...
Shielded Connectors For EMI, EMC Protection Samtec is expanding its line of rugged, high-speed 0.80 mm pitch Edge Rate® interconnects. First is a mating set with both socket (ERF8 Series) and terminal (ERM8 Series) strips that are fully shielded. The shield encircles the entire m...
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Kevin Burt, of the Samtec Optical Group, explains another one of the several demos that Samtec presented at OFC 2017.  In this demo, four GT 28 Gbps transceiver signals are generated by an FPGA and launched mid-board from a FireFly™ 28 G x4 optical connector system. These 28 Gbps...
Our friend Eric Bogatin wrote a paper for DesignCon 2017 entitled “New Characterization Technique for Glass-Weave Skew.”  He wrote a summary article of the paper in Signal Integrity Journal. Since many of our readers strive to optimize their signal transmission path, I thought it...
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