Connectors

Connectors

Samtec offers the largest variety of board-to-board interconnects in the industry. Popular applications include high speed mezzanine and high density array systems, high speed edge card and backplane systems, and micro pitch board stacking systems down to 0.40 mm pitch and 1 mm stack height. Micro rugged products feature Samtec’s Tiger Eye™ contact system on a variety of pitches, as well as high power strips and signal/power combination connectors to 60A/blade. Standard board-to-board header and socket systems are available in a variety of pitch, density, stack height, and orientation.

High-Speed Board-to-Board

High-Speed Board-to-Board

Mezzanine systems with integral ground planes, high-density arrays, ExaMAX® backplane interconnects, rugged Edge Rate® systems and high-speed performance to 28+ Gbps.

Micro Pitch Board-To-Board

Micro Pitch Board-To-Board

Interconnect systems with pitch availability as small as 0.40 mm and stack heights as low as 1 mm.

Rugged / Power

Rugged / Power

Power interconnects designed to meet high current applications, and micro rugged interconnects for high-reliability, high-retention and high cycle life.

Edge Card Connector Systems

Edge Card Connector Systems

High-speed edge card interconnects on choice of 0.50 mm, 0.635 mm, 0.80 mm, 1.00 mm, 1.27 mm or 2.00 mm pitch and a variety of orientations.

Standard Board-To-Board

Standard Board-To-Board

Board stacking interconnects for low profile, elevated, pass-through, and rugged applications on .100" (2.54 mm) and 2.00 mm pitch.

Backplane / Micro Backplane

Backplane / Micro Backplane

ExaMAX® high-speed backplane system for 28 Gbps performance, and micro backplane solutions including edge card sockets, high-density arrays, integral ground planes and rugged Edge Rate® interconnects.

Industry Standards

Industry Standards

Certified or compliant to most industry standards, including VITA, PCIe®, PC/104™, QSFP+, InfiniBand™, JTAG, etc.

Samtec receives daily requests from designers looking for customized solutions for application-specific interconnect needs. Samtec has turned the quick-turn prototype model from our Sudden Service® Advantage into a standard design methodology. Numerous customers were interested i...
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Samtec will be introducing several new products at DesignCon 2018. All of these products are designed to increase data rates, increase system density, and shrink product footprints, so designers can meet their system signal integrity needs. NovaRay™ High Bandwidth, High Density A...
Wow. What a fun year for Samtec.com and the entire team behind it! In 2017, we streamlined your online sampling experience, brought you a way to view detailed information about any of our trillions of part numbers, built an entirely new on-site search, upgraded to Azure CDN and A...
DesignCon 2018, which is a big deal for Samtec, is a few weeks away. Our high-speed technologies for Silicon-to-Silicon optimization will be on full display and our product experts will show new products that are just released, or will be released in 2018.  Our application engine...
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