Einteilige High-Speed Kompressions-Arrays mit niedrigem Profil, einer Körperhöhe von nur 1.27 mm und doppelten oder einfachen Kompressionskontakten.

Eigenschaften

  • 1.27 mm Standard-Gehäusehöhe
  • 1.00-mm-Raster
  • Duale Kompression oder einfache Kompression mit Lötkugeln
  • 100–300 Kontakte
  • Ideal für kostengünstige Board-Module, Modul-zu-Board und LGA-Schnittstellen
  • Minimiert Probleme infolge von thermischer Ausdehnung

VIDEOS

Samtec Advanced Interconnect Design Technology Center

Produkte

GMI

1.00 mm Kompressions-Interposer mit niedrigem Profil

Eigenschaften
  • Duale Kompressionskontakte
  • Bis zu 300 I/O
  • Niedriges Profil – 1.27 mm Standardhöhe
1.00 mm Kompressions-Interposer mit niedrigem Profil

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