Features
- Maximum routing and grounding flexibility
- Lower insertion/extraction forces vs. typical array products
- Performance up to 28 Gbps NRZ/56 Gbps PAM4
- Up to 560 I/Os in an open-pin-field design
- 1.27 mm (.050") pitch (Space saving 0.80 mm pitch system also available)
- Rugged Edge Rate® contact system
- Can be "zippered" during mating/unmating
- Solder charge terminations for ease of processing
- Meets Extended Life Product™ (E.L.P.™) standards
- 7 - 40 mm stack heights
- Vertical, right-angle, press-fit
- 85 Ω systems
- VITA 47, VITA 57.1, VITA 57.4, VITA 74, VITA 88 and Pismo 2 certified
- IPC J-STD-001F, Requirements for Soldered Electrical and Electronic Assemblies – Meets Class 3 Acceptability Criteria for High Performance/Harsh Environment
- Electronic Products (SEAM/SEAF Series only)
- IPC-A-610F, Acceptability of Electronic Assemblies – Meets Class 3 Acceptability Criteria for High Performance/Harsh Environment Electronic Products (SEAM/SEAF Series only)
Your Privacy Choices