त्रिभुजाकार चेतावनी यह साइट वेबसाइट के फंक्‍शंस और हमारी प्रचारात्‍मक और मार्केटिंग की कोशिशों का सहयोग करने के लिए कुकीज़ और अन्‍य वेबसाइट मॉनीटरिंग तकनीकों का इस्‍तेमाल करती है। स्‍वीकार है पर क्लिक करके, आप हाल ही में अपडेट की गई हमारी गोपनीयता नीति और नीति मार्गदर्शिका के नियमों को स्‍वीकार करते हैं।
स्‍वीकार है अस्‍वीकृत है
त्रिभुजाकार चेतावनी यह साइट वेबसाइट के फंक्‍शंस और हमारी प्रचारात्‍मक और मार्केटिंग की कोशिशों का सहयोग करने के लिए कुकीज़ और अन्‍य वेबसाइट मॉनीटरिंग तकनीकों का इस्‍तेमाल करती है। स्‍वीकार है पर क्लिक करके, आप हाल ही में अपडेट की गई हमारी गोपनीयता नीति और नीति मार्गदर्शिका के नियमों को स्‍वीकार करते हैं।
स्‍वीकार है अस्‍वीकृत है

>Si-Fly 112 Gbps PAM4, Low-Profile High-Density Cable System

Si-Fly 112 Gbps PAM4, Low-Profile High-Density Cable System

Si-Fly uses direct connect technology to elude the BGA and route signals directly from the silicon package through a long-reach cable.


फैमिली अवलोकन

Samtec - Direct Connect to IC Package

The ultra-high density design and on-package direct connect technology of Samtec’s Si-Fly cable system enables speeds of 25.6 TB aggregate, with a path to 51.2 TB. The signal channel eludes the BGA, routing directly from the IC package through a long-reach cable offering 5x the reach of traditional PCB topologies.

विशेषताएँ

Direct Connect to IC Package

Ultra-high density with direct connect to IC Package technology
Direct Connect

Extreme Channel Performance

Enabling 51.2 TB aggregate data rate by 2023
Extreme Channel Performance

~5x the reach, compared to traditional PCB

Copper Si-Fly 22-inch reach versus PCB 4.5-inch reach.

Si-Fly offers longer reach and better performance, compared to traditional PCB topology.

सिग्नल की अखंडता

Long-reach comparison: Si-Fly versus Megtron 7 PCB

Measured at 112 Gbps PAM4 with IEEE 802.3cK allowable loss.

Test setup: click here

firefly आसान संगम

Samtec offers two Direct Connect on-package solutions:

  • FireFly (available now)
  • Si-Fly (in development)
solutions

सीरीज़

CPC

Copper Si-Fly™ Low-Profile, High-Density Cable System

विशेषताएँ
  • Si-Fly™ copper Flyover® cable assembly; optics on the roadmap
  • Direct attach to IC Package
  • Ultra-high density enabling 25.6 TB aggregate with a path to 51.2 TB
  • 112 Gbps PAM4 per lane
  • 5x the reach of traditional PCB solutions
  • Eludes the BGA and routes signals directly from the silicon package through a long-reach cable
Copper Si-Fly™ Low-Profile, High-Density Cable System

संपर्क बिक्री

नाम का पहला शब्द
नाम का अंतिम शब्द
ईमेल
कंपनी
उद्योग
अनुमानित वार्षिक उपयोग
फैमिली
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