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triangle alert Our manufacturing capacity has been influenced by this pandemic, but our global operations team has been working tirelessly to maximize our output and minimize the impact to all our customers while prioritizing COVID-19 critical response applications. Some part numbers are experiencing delays, but many are not. You can access real-time lead times online within your account, chat, or call us anytime for the latest information. ×

Board-to-Board Connectors

Board-to-Board Connectors

Samtec offers the largest variety of board-to-board connectors in the industry. Popular applications include high speed mezzanine and high density array systems, high speed edge card and backplane systems, and micro pitch board stacking systems down to 0.40 mm pitch and 1 mm stack height. Micro rugged products feature Samtec’s Tiger Eye™ contact system on a variety of pitches, as well as high power strips and signal/power combination connectors to 60A/blade. Standard board-to-board header and socket systems are available in a variety of pitch, density, stack height, and orientation.

High-Speed Board-to-Board Connectors

High-Speed Board-to-Board Connectors

Mezzanine systems with integral ground planes, high-density arrays, backplane interconnects, rugged signal integrity optimized Edge Rate® systems and high-speed performance to 56 Gbps NRZ/112 Gbps PAM4.

Micro Pitch Board-To-Board

Micro Pitch Board-To-Board

Interconnect systems with fine pitch availability as small as 0.40 mm and stack heights as low as 1 mm.

Rugged / Power

Rugged / Power

Power interconnects designed to meet high current applications, and micro rugged interconnects for high-reliability, high-retention and high cycle life.

Edge Card Connector Systems

Edge Card Connector Systems

High-speed edge card interconnects on choice of 0.50 mm, 0.60 mm, 0.635 mm, 0.80 mm, 1.00 mm, 1.27 mm or 2.00 mm pitch and a variety of orientations.

Standard Board-To-Board

Standard Board-To-Board

Board stacking interconnects for low profile, elevated, pass-through, and rugged applications on .100" (2.54 mm) and 2.00 mm pitch.

Backplane / Micro Backplane

Backplane / Micro Backplane

ExaMAX® high-speed backplane system for 56 Gbps PAM4 performance, XCede® HD high-density backplane solutions for design flexibility and micro backplane solutions including edge card sockets, high-density arrays, integral ground planes and rugged Edge Rate® interconnects.

Industry Standards

Industry Standards

Certified or compliant to most industry standards, including VITA, PCIe®, PC/104™, QSFP+, InfiniBand™, JTAG, etc.

IPC-A-610 covers a wide range of solder joints, and what it takes to meet Classes 1 – 3 in varying types of of connector termination styles. These classifications help a manufacturer determine if a connector is capable of being used in their application. In a previous blog, I dis...
In March 2020, the web team focused heavily on some larger features that we are working on for release in the spring. You’ll be reading about these in a few upcoming posts. Here are a few smaller updates we were able to roll out in March 2020. New Online Features for Managing Ord...
There are many historical innovations that are the product of adversity, and the current situation is an extreme example.  While it is not the first time that humanity has faced a truly global challenge like the COVID-19 pandemic, this time the world is connected by technology in...
Telecommuting. Mobile work. Remote work. Flexible work. Work from home (WFH). They all mean the same thing. What do all of these have to do with Chalk Talks? Who would have guessed so many would WFH? The global COVID-19 outbreak is the reason. So, staying connected is a must. The...
Commercial Off-the-Shelf (COTS) products are making their way into industries that wouldn’t have considered them previously. This is mainly due to the flexibility, speed of delivery, and cost savings that COTS products offer when compared to a full MIL-SPEC product. However, this...