LP Array™ SI Evaluation Kit

Samtec LP Array™ Low Profile Open-Pin-Field Arrays support high-speed, high density applications with maximum routing and grounding flexibility. The LP Array™ SI Evaluation Kit provides system designers and SI engineers an easy-to-use solution for testing LP Array™ connectors.

The LP Array™ SI Evaluation Kit delivers a high-quality system with robust mechanical design. It can be used standalone for LP Array™ connectors. Please contact Samtec’s technical experts at KitsAndBoards@samtec.com for additional information.

• Two PCB system with compact form factor
• One PCB contains LPAM connector (LPAM-40-XX-X-L-08-2-K-TR)
• Second PCB contains LPAF connector (LPAF-40-XX.X-L-08-2-K-TR)
• Supports multiple LPAM/LPAF stack heights (4 mm/4.5 mm/5 mm)
• Routes high-speed differential pairs (20 total) from LPAM/LPAF connectors to high-precision RF connectors
• Supports multiple high-precision RF connector options (2.40 mm/2.92 mm SMAs)
• Optimized SI performance via Samtec Final Inch® BOR PCB trace routing
• Enable time domain measurements via direct connection to TDR/TDTs
• Enable frequency domain measurements via direct connection to VNAs