triangle alert This site uses cookies and other website monitoring technologies to assist with website functions and with our promotional and marketing efforts. By clicking Accept, you consent to the terms in our recently updated Privacy Notice and Policy Manual.
Accept Decline
triangle alert This site uses cookies and other website monitoring technologies to assist with website functions and with our promotional and marketing efforts. By clicking Accept, you consent to the terms in our recently updated Privacy Notice and Policy Manual.
Accept Decline

SEAF-10-05.0-L-04-1-A-K-TR

.050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Socket

This open pin field array socket features a 1.27 mm x 1.27 mm pitch grid with up to 500 total I/Os. The rugged Edge Rate® contact system is signal integrity optimized with solder charged terminations for ease of processing. SEAF is a 28+ Gbps performance interconnect with low insertion/extraction forces and stack heights from 7 mm to 17.5 mm.

Features
  • Up to 500 I/Os
  • .050" (1.27 mm) pitch
  • Rugged Edge Rate® contact
  • 56 Gbps PAM4 performance
  • Stack heights from 7 mm - 18.5 mm
  • Lower insertion/withdrawal forces
  • Solder charge termination
  • Dual sourced by Molex®
  • IPC J-STD-001F, requirements for soldered electrical and electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products
  • IPC-A-610F, acceptability of electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products
3D Models

Looking for a 3D model? Select your format and download your model.

Specs Kit

Secured form. No spam.

Ships Immediately: 124 pieces

  Distributor Stock: 1100 pieces 

 |  Large Volume Lead Time: 2 weeks

Buckets 1 250 500 750 1000
Price $5.88 $4.9 $4.16 $3.7 $3.38

Packaging Notes: Packaging Type: Tape & Reel (475 parts per reel)

Please Login to see customer specific pricing. Or you may directly contact support.

You don't have an account? Create one

. .
.
. .
In 1995, I attended a seminar in which the presenter told us that copper was dead.  This sort of statement is not new. The connector market is filled with armchair pundits who predict the demise of everything from D-Subminiature connectors (which are very much alive and kicking) ...
The FPGA (or ACAP) universe gathered at the San Jose Fairmount last week during the Xilinx Developer Forum. Engineers, data scientists, analysts, distributors, alliance partners and more came to learn about the latest hardware, software and system level solutions from Xilinx. Xil...
Samtec recently held its first annual Samtec Cares Day, where we welcomed dozens of local non-profits to our headquarters in New Albany, Indiana. The Samtec Cares Grant Program was created to positively impact and assist organizations within the communities in which Samtec associ...
Increasing data demand requires faster data rates across the data center. This is especially true of the transceivers and pluggable cages and modules common to these applications. One company can’t do it alone. MSAs continue to proliferate as component manufacturers, equipment pr...
In the first part of this series on Severe Environment Testing (SET) we covered Electrostatic Discharge (ESD) and Dielectric Withstanding Voltage (DWV) at an altitude of 70,000 ft. Continuing on the path of “how” we tested, we will be looking at the other tests that were introduc...