This array receptacle is part of a three-piece elevated mezzanine system with a 35 mm standard stack height, which aids in system airflow. The 1.5 mm x 1.75 mm pitch receptacle features a low profile design, which keeps thermal mass low for reflow processing, and BGA solder ball technology. The three-piece system is available with choice of 50, 100 or 150 pairs as well as tools for installation and removal.
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