TPAF

1.50 mm x 1.75 mm High-Speed Elevated Array Receptacle

This array receptacle is part of a three-piece elevated mezzanine system with a 35 mm standard stack height, which aids in system airflow. The 1.5 mm x 1.75 mm pitch receptacle features a low profile design, which keeps thermal mass low for reflow processing, and BGA solder ball technology. The three-piece system is available with choice of 50, 100 or 150 pairs as well as tools for installation and removal.

Features
  • Up to 300 signals, 150 pairs
  • BGA (solder ball) technology
  • Low profile keeps thermal mass low for reflow processing
  • Dual sourced by Hirose® IT5
  • Selective gold Plating
Mates

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1.50 mm x 1.75 mm High-Speed Elevated Array Receptacle

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