Samtec Teraspeed Consulting

From the early stages of the design process including package design, material selection and PCB routing, through in-depth analysis, modeling and simulation, with measurement validation services available to 67 GHz Samtec Teraspeed Consulting services can help you optimize and validate your high-performance systems.

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Overview

teraspeed

Key Capabilities & Services

As requirements for smaller, faster, and more integrated microelectronics increase, the challenges designers face intensify exponentially. Samtec offers a unique blend of signal integrity and advanced IC packaging expertise to provide full channel system support for these next generation challenges.

Advanced Package & PCB Design

Expertise in package and PCB layout, structural analysis, signal/power integrity optimization and material characterization allows us to help you design any package and PCB, whether it is a tough DDR 3/4 design, multiple PCIe® Gen4 lanes, or a high performance next-generation 56 Gbps (and beyond) channel.

Samtec Teraspeed Consulting offers full channel expertise and support for package and PCB design needs.

Our capabilities include:

  • Signal Integrity-enabled package layout
  • Signal integrity & power integrity design
  • Design kits for any design at signaling rates up to, and including, 28 Gbps & 56 Gbps
  • I/O buffer sizing
  • Package characterization
  • Materials recommendations

Samtec's extensive microelectronics and high-speed interconnect expertise, along with our proven methods for package integration, miniaturization, wafer level processing and signal integrity optimization, enable us to provide a unique level of support for advanced microelectronics applications. Capabilities include:

Advanced Package & PCB Design
Advanced Package & PCB Design

Signal Integrity

Samtec Teraspeed Consulting provides in-depth analysis, testing and validation services, including characterization at frequencies to 67 GHz and beyond, with advanced signal integrity engineering. Our services encompass all areas of IC package, board and enclosure verification, as well as research and development.

We provide advanced signal integrity engineering services to companies worldwide. We believe in pushing the envelope of performance and sharing our experiences with others. Our Signal and Power Integrity services encompass all areas of IC package, board, and enclosure verification, including:

  • Channel analysis, optimization & design
  • Backplane design
  • Copper/Cable/Optical interconnect engineering
  • Single-ended & differential bus design
  • Statistical analysis
  • Future-proof design for the highest possible data rates
  • 2D, 2.5D and 3D industry standard simulators
  • DDR3/4, LPDDR3, GDDR5
  • PCIe® Gen4, 10G, 12G, 14G, 28G, 56G
  • Extensive coupling and crosstalk (NEXT & FEXT) experience
Signal / Power Integrity
Signal / Power Integrity

Modeling & Simulation

Samtec Teraspeed Consulting offers modeling and simulation for high-performance systems, including validation of implementation and signaling requirements for critical channels, high bandwidth full-wave simulations, along with design rules for package and PCB designs.

We use EM solvers, simulation software, and methods that have been validated against theory and practice with precise measurement techniques valid to 50 GHz and beyond. Our capabilities include high bandwidth full-wave S-Parameter model extraction for:

  • Semiconductor packaging (digital and RF)
  • Multi-chip Module (MCM) packaging
  • Printed Circuit Boards (PCB)
  • Connectors and connector launch transitions
  • Capacitors
  • Via structures
  • Cables and cable transitions
  • EMI
  • Extensive coupling and crosstalk (NEXT & FEXT) experience
  • Ability to create & datamine models with 512 ports & larger
Modeling & Simulation
Modeling & Simulation

Flyover® Architecture

Solutions for routing high-speed signals at increasing bandwidths, such as Samtec’s Flyover® Architecture, require high level design and engineering support, including expertise in signal integrity optimization, routing and thermal management strategies, and materials selection. Samtec Teraspeed Consulting engineers have the experience and expertise to help address and support these challenges.

As bandwidth requirements rapidly increase, routing signals through lossy PCBs, vias and other components has become one of the most complex challenges designers face. Next generation solutions such as Samtec’s Flyover® Architecture are made possible with the expertise of Samtec’s signal integrity engineers, who provide high level design assistance and engineering support for high-performance system challenges, including:

  • Improving signal integrity and reach at increasing data rates
  • Increasing system architecture flexibility
  • Reducing power consumption
  • Reducing PCB costs by enabling lower layer counts and less expensive materials
  • Improving thermal dissipation through power reduction and IC placement flexibility
  • Maximizing density
  • Simplifying board layouts
  • PCB routing / layout strategies
Flyover® Architecture

Optimize your System

The closer we get to the Silicon, the more opportunities there are for us to assist you in your initial design, and guide you through the entire product design cycle.
Let us know how we can help you optimize your system!

Toll Free US & Canada

+1-844-483-7773 (4TERSPD)

Tel +1-812-981-8398

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