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A unique blend of unmatched Signal Integrity and IC Packaging expertise positions Samtec to provide full channel system support, effectively streamlining, and thereby optimizing, the signal path - from the IC to the board and beyond.
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Whatever your application or high speed design requirements, we've got the tools, support and services to help you optimize performance from Silicon-to-Silicon™
We make it easy to ensure your system will perform at its maximum, with an array of free
design, data and reference tools for the selection, development, simulation
and testing of high speed systems.
Our Signal Integrity Group has put together a wide array of resources
available to you free of charge including Electrical Models, 3D Models,
and a large library of PADs and OrCAD models.
3D Models are available in multiple formats and variations.
PADs/PCB Library model files in many formats can save designers hours of tedious, yet critical effort.
Electrical Models are available as Synopsys®, Cadence® Allegro PCB SI (DML ESPICE) and Mentor Graphics® HyperLynx®. Touchstone S-Parameter files are available upon request.
Samtec's Signal Integrity Group offers unparalleled support at a local level,
the best solution for your particular application by providing easy access to free online data,
as well as engineer-to-engineer support for more complex applications.
As 28 Gpbs systems start to move into the mainstream markets, the need to develop solutions that support
both density and signal integrity is becoming increasingly important. At these extreme speeds,
taking the concept of signal integrity optimization beyond the connector and into the entire system has become a
necessity. Samtec offers complete Silicon-to-Silicon signal integrity design solutions.
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