Overview

Samtec offers a comprehensive portfolio of high-performance interconnect solutions for semiconductor and computing applications, including artificial intelligence/machine learning; prototype, development, and evaluation; semiconductor manufacturing; quantum computing; and high-performance computing/supercomputing.

Samtec's world-renowned team of technical experts, its suite of online design tools, and world-class Sudden Service® are available to support any computer and semiconductor application, from design to production.

APPLICATIONS

Samtec offers a wide variety of solutions for any type of computer and semiconductor applications.


POPULAR PRODUCTS

Choose from some of Samtec's most popular products for Computer & Semiconductor Applications


AcceleRate® HP High-Performance ArraysAcceleRate® HP High-Performance Arrays

AcceleRate® HP 0.635 mm pitch arrays feature 112 Gbps PAM4 extreme performance and a flexible open-pin-field design. View the full line of AcceleRate® products.

Features
  • 0.635 mm pitch open-pin-field array
  • 56 Gbps NRZ/112 Gbps PAM4 performance
  • Cost optimized solution
  • Low-profile 5 mm and up to 10 mm stack heights
  • Up to 400 total pins available; roadmap to 1,000+ pins
  • Data rate compatible with PCIe® 6.0/CXL® 3.1 and 100 GbE
  • Analog Over Array™ capable
  • View the full line of AcceleRate® products
Products
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  • APM6
  • APF6
  • APF6-RA
  • GPSO
  • GPSK
  • GPPK
AcceleRate® HP High-Performance Arrays

Bulls Eye®Bulls Eye® RF High-Performance Test to 90 GHz

Bulls Eye® high-performance test assembly features a high-density space saving design that enables smaller evaluation boards and shorter trace lengths in test and measurement applications. The Bulls Eye® block compression mounts to the board for placement directly adjacent to the SerDes being characterized. The solderless design improves overall cost and is easy to use within a lab setting.

Features
  • 90 GHz, 70 GHz, 50 GHz and 40 GHz test assemblies
  • Compression mounts to the board for placement directly adjacent to the SerDes being characterized
  • Solderless design improves cost
  • Easy to use within a lab setting
  • Microstrip/CPW or Stripline PCB transmission
  • End 2 connection to instrumentation: 1.00 mm, 1.85 mm, 2.40 mm or 2.92 mm
  • High-density, space-saving design
  • Single or double row
  • Test boards available for performance verification
  • RF Group: dedicated RF engineers provide personal support for meeting specific RF challenges
Products
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  • BE90A
  • BE70A
  • BE40A
Bulls Eye®

NovaRay®NovaRay® 112 Gbps PAM4 Array, Extreme Density Arrays

NovaRay® combines extreme density and performance for this 112 Gbps PAM4 array per channel in 40% less space than traditional arrays.

Features
  • 112 Gbps PAM4 per channel
  • 4.0 Tbps aggregate data rate - 9 IEEE 400G channels
  • PCIe® 6.0/CXL® 3.1 capable
  • Innovative, fully shielded differential pair design enables extremely low crosstalk (beyond 40 GHz) and tight impedance control
  • Two points of contact ensure a more reliable connection
  • 92 Ω solution addresses both 85 Ω and 100 Ω applications
  • Analog Over Array™ capable
Products
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  • NVAM
  • NVAF
  • GPSO
  • NVAC
  • NVAM-CT
  • NVBF
  • NVBM-RA
NovaRay®

ExaMAX®ExaMAX® High-Speed Backplane System

ExaMAX® high-speed backplane interconnects deliver 64 Gbps PAM4 (32 Gbps NRZ) electrical performance.

Features
  • Enables 64 Gbps PAM4 (32 Gbps NRZ) electrical performance on 2.00 mm column pitch
  • PCIe® 6.0/CXL® 3.1 capable
  • Allows designers to optimize density or minimize board layer count
  • Two reliable points of contact, even when subjected to angled mating
  • Meets Telcordia GR-1217 CORE specification
  • Individual signal wafers with staggered differential pair design; 24 - 72 pairs (board connectors) and 16 - 96 pairs (cable assemblies)
  • One-piece embossed ground structure on each signal wafer to reduce crosstalk
  • Lowest mating force on the market: 0.36 N max per contact
  • Backplane cable assemblies improve signal integrity and increase signal path length at higher data rates
  • Samtec’s Eye Speed® ultra low skew twinax cable provides increased flexibility and routability
  • Stub free mating
  • Press-fit termination
  • Power and Guide Modules available
Products
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  • EBTM
  • EBTM-RA
  • EBTF-RA
  • EBDM-RA
  • EBCM
  • EBCF
  • EGBM
  • EGBF
  • EPTT
  • EPTS
  • EBCL
  • EBCB
ExaMAX®

SEARAY™SEARAY™ High Density Open Pin Field Arrays

These high-speed, high-density open pin field arrays allow maximum grounding and routing flexibility.

Features
  • Maximum routing and grounding flexibility
  • Lower insertion/extraction forces vs. typical array products
  • 56 Gbps PAM4 performance
  • Up to 560 I/Os in open pin field design
  • 1.27 mm (.050") pitch
  • Rugged Edge Rate® contact system
  • Can be "zippered" during mating/unmating
  • Solder charge terminations for ease of processing
  • Meets Extended Life Product™ (E.L.P.™) standards
  • Analog Over Array™ capable
  • 7 - 18.5 mm stack heights
  • Vertical, right-angle, press-fit
  • Elevated systems to 40 mm
  • 85 ohm systems
  • Standards: VITA 47, VITA 57.1 FMC, VITA 57.4 FMC+, VITA 74 VNX, PISMO™ 2
  • IPC J-STD-001F, requirements for soldered electrical and electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products (SEAM/SEAF series only)
  • IPC-A-610F, acceptability of electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products (SEAM/SEAF series only)
Products
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  • SEAF
  • SEAM
  • SEAF-RA
  • SEAM-RA
  • SEAMP
  • SEAFP
  • SEAFP-RA
  • SEAR
  • SEAMI
  • JSO
  • GPPK
  • GPSK
SEARAY™


Precision RF Precision RF

Microwave/Millimeter Wave Cable Assemblies & Connectors

Features
  • High-frequency, microwave/millimeter wave solutions to 110 GHz
  • Cable assemblies, cable connectors and board level connectors
  • Variety of interfaces: 1.00 mm, 1.35 mm, 1.85 mm, 2.40 mm, 2.92 mm, 3.50 mm, SSMA, SMP, SMPM, ganged SMPM, SMA, N Type, TNCA
  • Magnum RF™ ganged SMPM for 40% greater density, less processing time and better positional alignment
  • Low-loss microwave and millimeter wave cable from .047" to .277"
  • Vertical or edge launch solderless compression mount board connectors for test and measurement applications
  • Soldered push-on board connectors for high-density, blind-mate applications
  • Between-series and in-series adaptors designed for well-performing VSWR
Precision RF Family

XCede® HDXCede® HD High-Density Backplane System

Small form factor high-density backplane system ideal for density-critical applications, with a modular design and optional features for flexibility and customizable solutions.

Features
  • Small form factor provides significant space savings
  • Modular design provides flexibility in applications
  • High-performance system
  • High-density backplane system – up to 84 differential pairs per linear inch
  • 1.80 mm column pitch
  • 3-, 4- and 6-pair designs
  • 4, 6 or 8 columns
  • 12 - 48 pairs
  • Multiple signal/ground pin staging options
  • Integrated power, guidance, keying and side walls available
  • 85 Ω and 100 Ω options
  • Three levels of sequencing enable hot plugging
  • Cost-effective designs available for low-speed applications
Products
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  • HDTF
  • HDTM
  • BSP
  • HPTS
  • HPTT
XCede® HD

Firefly™ Micro Flyover System™Micro Flyover On-Board Optical Engine, FireFly™

Future-proof system with interchangeability of FireFly™ copper and optical using the same micro mxc connector system for up to 28 Gbps per lane.

Features
  • High-speed performance to 28 Gbps per lane
  • x4 and x12 designs
  • Variety of integral heat sink and End 2 options
  • Interchangeability of copper and optical
  • Micro rugged two-piece connector
  • Extended temperature and PCIe®-Over-Fiber solutions
Products
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  • ECUO
  • PCUO
  • ETUO
  • ETMO
  • PTUO
  • ECUE
  • PCUE
  • UEC5-1
  • UEC5-2
  • UCC8
  • PCOA
Firefly™ Micro Flyover System™

Testing and Certifications


Samtec's products are tested to or beyond industry standards to ensure quality and performance in computer and semiconductor applications.

extended life
severe environment tested

SAMTEC PICTURE SEARCH

Visually Find Your Solution


As I write this post, we’re in the final stages of completing a massive project to upgrade all of the main product navigation pages on Samtec.com. The current navigation structure […] The post Here’s Your Preview of the New Samtec.com Navigation appeared first on The Samtec Blog....
Samtec open-pin-field arrays like SEARAY™ provide designers the ability to simultaneously run differential pairs, single-ended signals, and power through the same board-to-board interconnect. This design approach allows maximum pin-selection, routing, […] The post AMD XRF4 RF Acc...
Samtec showcased several high-performance, high-density active optical connector systems at DesignCon 2024. These were in addition to a booth full of Samtec Flyover® copper cable solutions rated at 224 and […] The post Good Optics: High-Performance, High-Density Active Optical C...
Samtec demonstrated many high-performance RF test and measurement solutions at DesignCon 2024. In this video, David Beraun, Samtec’s RF Product Manager, takes a quick look at some of those high-performance […] The post New Samtec RF Test and Measurement Solutions At DesignCon 202...
Samtec will be demonstrating next-gen, high-performance optical and copper interconnect solutions at the upcoming OFC 2024 Exhibition at the San Diego Convention Center, San Diego, CA March 26-28, 2024. OFC […] The post Samtec Exhibits at OFC 2024 in San Diego appeared first on T...