Connectivity Solutions For Emerging

Artificial Intelligence Architectures

industrial applications space

Rapidly-growing technologies like Artificial Intelligence / Machine Learning are driving new system architectures that demand increased speeds, bandwidths, frequencies and densities, along with scalability and configurability. To meet these challenges, Samtec offers innovative connectivity solutions ideal for next generation AI/ML applications – from testing and development, to high-performance interconnects, along with full system optimization support.

next gen system expertise
next gen system expertise

NEXT GEN SYSTEM
EXPERTISE

high-performance interconnects
high-performance interconnects

HIGH-PERFORMANCE
INTERCONNECTS

full system support
full system support

FULL SYSTEM SUPPORT

APPLICATIONS

Samtec offers a wide variety of solutions for next generation AI/ML applications.


chipsets

CHIPSETS

Computing Platforms
Characterization Kits & Boards
Reference Designs

embedded platforms

EMBEDDED PLATFORMS

System on Modules (SoMs)
Computer on Modules (CoMs)
Carrier Cards

accelerators

ACCELERATORS

GPU/CPU Modules
Vision Systems
Array Servers

application specific architectures

APPLICATION SPECIFIC

Ultra-low Latency, High Data Rates,
High-Density, Low Ping Solutions

Interconnect Solutions

Samtec offers a broad line of cost-effective, high pin count, extreme performance / density, and high mating cycle interconnect solutions, ideal for a wide range of high-performance test platforms.


high-ensity arrays / cables

High-Speed Mezz
& High-Density Arrays

high-speed edge card sockets

High-Performance Test
& Precision RF

flyover technology

Ultra Micro /
High Power

flyover technology

High-Performance
Cable Systems

Full System Support


As bandwidth, scale and power requirements continue to challenge conventional engineering methods, Samtec leverages industry-leading expertise to help optimize the entire high-performance system, offering innovative online design tools, an extensive library of characterization and development kits, along with engineering and testing support to help streamline the development process.
Contact sig@samtec.com to discuss your application.

Industry Leading Signal Integrity Expertise

Industry Leading
Signal Integrity Expertise

Characterization Development Boards

Characterization &
Development Boards

Online Design &
Development Tools

SAMTEC PICTURE SEARCH

Visually Find Your Solution


(This is the second in a series of blogs, from Sandeep Sankararaman, Samtec’s Principal RF and Signal Integrity Engineer, discussing design strategies for high-bandwidth RF launches. The first is entitled “What Is An RF Connector Launch?” The third, coming next week, discusses GN...
If you’ve been paying attention to the Coming Soon section in our most recent web updates, you might have noticed we have been working on an upgraded Checkout system for the website for the last several months. We’re happy to announce that this application is now accepting orders...
As signal speeds increase, each part of the signal path getting to and from the device needs to work to higher frequencies.  Strategies that worked in the past no longer suffice and cheaper connectors no longer make the cut. Cable lengths and trace lengths need to get shorter to ...
This month, we released a major new version of our Checkout to a beta state, made some upgrades to how we show lead times online, made 3D model downloads easier from the Search, and released a few more content updates. Here are the major website updates to Samtec.com for July 202...
Something occurred to me recently. AI hardware system architectures are really applications-specific. Computing platforms from laptops, desktops, workstations and servers follow classical architectures. Inputs, outputs, a central processing unit, busses (control, data and memory)...