High-Speed Interconnect Solutions


Samtec offers the largest variety of high-speed board-to-board and backplane interconnects in the industry with full engineering support, online tools and an unmatched service attitude.

High-Speed
Performance

Application
Flexibility

Signal Integrity
Support

High-Speed Interconnect Solutions


Samtec offers the largest variety of high-speed board-to-board and backplane interconnects in the industry with full engineering support, online tools and an unmatched service attitude.

High-Speed
Performance

  • Speeds to 112 Gbps PAM4
  • More than 4.0 Tbps of
    aggregate bandwidth
  • Extremely low crosstalk to 40 GHz

Application
Flexibility

  • 10-3,000 positions
  • 0.33 mm - 40 mm stack heights
  • Vertical, right-angle, edge mount

Signal Integrity
Support

  • Free test reports, models, app notes,
    Break Out Region
  • Easy access to live EE support
  • Online tools: Simulator™
    and Channelyzer®

High-Speed Performance


High speeds & increased bandwidth with optimized signal integrity

16 Gbps
guide posts
28 Gbps
board standoffs

Speeds for now
and the future

High-Speed Performance


High speeds & increased bandwidth with optimized signal integrity

16 Gbps
guide posts
28 Gbps
board standoffs

Speeds for now
and the future

Application FLexibility


A wide range of options to meet the demands of any high-speed, high-density application

High-Density Arrays
Pitch: 0.65, 0.80, 1.00 and 1.27 mm. Pin Count: 8 - 720 positions. Stack Height: 0.33 - 40 mm. Options: Right-angle, press-fit, 85 Ω tuned, mating/alignment hardware, standoffs, mating cables.
Edge Rate® Interconnects
Pitch: 0.50, 0.635 and 0.80 mm. Pin Count: 10 - 200 positions. Stack Height: 5 - 18 mm. Options: Right-angle, edge mount, differential pair, hot swap, latching, guide post, 360º shielding, mating cables.
Ground Plane Interconnects
Pitch: 0.50, 0.635 and 0.80 mm. Pin Count: 40 - 156 positions. Stack Height: 5 - 25 mm. Options: Right-angle, edge mount, differential pair, plastic/metal guide post, power, retention, RF, shielding, mating cable.
Ultra Micro Interconnects
Pitch: 0.40, 0.50 0.635 and 0.80 mm. Pin Count: 10 - 400 positions. Stack Height: 2 - 12 mm. Options:  Standard or reverse right-angle, 360º shielding, alignment pin, locking, mating cable.
Edge Card Systems
Pitch: 0.50, 0.60, 0.635, 0.80, 1.00, 1.27 and 2.00 mm. Pin Count: 10 - 300 positions. Orientation: Vertical, right-angle, edge mount, pass-through. Options:  Power/signal combo, press-fit, PCI Express®, justification beam, differential pair, locking, latching, mating cable.
High-Speed Backplane Systems
Pitch: 1.80 and 2.00 mm. Pin Count: 12 – 72 pairs (3, 4 & 6 pairs/column). Columns: 6, 8, 10 & 12. Options: Vertical, right-angle, coplanar, direct mate orthogonal, cable assembly, power, guidance, keying, staging, end walls.

Application FLexibility


A wide range of options to meet the demands of any high-speed, high-density application

High-Density Arrays
Pitch: 0.65, 0.80, 1.00 and 1.27 mm. Pin Count: 8 - 720 positions. Stack Height: 0.33 - 40 mm. Options: Right-angle, press-fit, 85 Ω tuned, mating/alignment hardware, standoffs, mating cables.
Edge Rate® Interconnects
Pitch: 0.50, 0.635 and 0.80 mm. Pin Count: 10 - 200 positions. Stack Height: 5 - 18 mm. Options: Right-angle, edge mount, differential pair, hot swap, latching, guide post, 360º shielding, mating cables.
Ground Plane Interconnects
Pitch: 0.50, 0.635 and 0.80 mm. Pin Count: 40 - 156 positions. Stack Height: 5 - 25 mm. Options: Right-angle, edge mount, differential pair, plastic/metal guide post, power, retention, RF, shielding, mating cable.
Ultra Micro Interconnects
Pitch: 0.40, 0.50 0.635 and 0.80 mm. Pin Count: 10 - 400 positions. Stack Height: 2 - 12 mm. Options:  Standard or reverse right-angle, 360º shielding, alignment pin, locking, mating cable.
Edge Card Systems
Pitch: 0.50, 0.60, 0.635, 0.80, 1.00, 1.27 and 2.00 mm. Pin Count: 10 - 300 positions. Orientation: Vertical, right-angle, edge mount, pass-through. Options:  Power/signal combo, press-fit, PCI Express®, justification beam, differential pair, locking, latching, mating cable.
High-Speed Backplane Systems
Pitch: 1.80 and 2.00 mm. Pin Count: 12 – 72 pairs (3, 4 & 6 pairs/column). Columns: 6, 8, 10 & 12. Options: Vertical, right-angle, coplanar, direct mate orthogonal, cable assembly, power, guidance, keying, staging, end walls.

Signal Integrity Support


In-house signal integrity expertise for complex applications

White Papers
Test Reports
Electrical/Mechanical Models
Electrical/Mechanical Models
Break out Region
Break out Region

Online Tools

Solutionator LogoShadow
Channelyzer LogoShadow
(This is the second in a series of blogs, from Sandeep Sankararaman, Samtec’s Principal RF and Signal Integrity Engineer, discussing design strategies for high-bandwidth RF launches. The first is entitled “What Is An RF Connector Launch?” The third, coming next week, discusses GN...
If you’ve been paying attention to the Coming Soon section in our most recent web updates, you might have noticed we have been working on an upgraded Checkout system for the website for the last several months. We’re happy to announce that this application is now accepting orders...
As signal speeds increase, each part of the signal path getting to and from the device needs to work to higher frequencies.  Strategies that worked in the past no longer suffice and cheaper connectors no longer make the cut. Cable lengths and trace lengths need to get shorter to ...
This month, we released a major new version of our Checkout to a beta state, made some upgrades to how we show lead times online, made 3D model downloads easier from the Search, and released a few more content updates. Here are the major website updates to Samtec.com for July 202...
Something occurred to me recently. AI hardware system architectures are really applications-specific. Computing platforms from laptops, desktops, workstations and servers follow classical architectures. Inputs, outputs, a central processing unit, busses (control, data and memory)...