Power.org

Overview

The Power Architecture was originally developed by IBM in the early 1980s. Power Architecture technology is used in many applications from consumer electronics to supercomputers. Facilitated by POWER.org, recent adoption of the high speed signal protocol required a new search for effective trace and debug connectors, new cables, and overall cost effective solutions that resolved a number of existing issues.

The Physical Connection group of the Common Debug Interface Technical Subcommittee (CDITSC) was formed in order to define the high speed serial protocol and the connection method for the next generation of Trace. The serial protocol and physical connectors were carefully selected over a period of several months by the committee specifically for scalability, minimal footprint, fine pitch, and signal integrity. The connectors chosen are the modified Samtec Edge Rate® family of connectors (ERM8/ERF8 Series) and henceforth within the specifications and among member developers referred to as the HSSTP connectors, HST-xxx, or POWER.org Trace Connector.

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Connectors

The POWER.org standard recommends Samtec’s Edge Rate® ERM8/ERF8 Series connector set. These customized ASP versions of ERM8/ERF8 Series provide four sizes: 11 positions, 17 positions, 23 positions, and 35 positions. These four sizes provide a family of solutions for those more concerned with real estate to those who seek the maximum number of signals.

Board-to-board solutions will have friction latches. Cable-to-board solutions will use the squeeze latch for higher mating retention force. Both solutions will be intermateable with the same female socket. All of the POWER.org recommended connectors from Samtec are listed below.

erf8 erm8 ebrochure

POWER.org Specified Connectors (Edge Rate®)

HSSTP DCU Edge Mount
Samtec PN
Pin Count
Positions
Description
Plating: K=30 µ" Gold
Prints
3D
PADS
ASP-137974-01

34

17

Male

K

PDF Print

IGES
PARASOLID
STEP

PADS File

ASP-133811-02

46

23

Male

K

PDF Print

IGES
PARASOLID
STEP

PADS File

ASP-135040-01

70

35

Male

K

PDF Print

IGES
PARASOLID
STEP

PADS File

HSSTP DCU Vertical
Samtec PN
Pin Count
Positions
Description
Plating: K=30 µ" Gold
Prints
3D
PADS
ASP-137968-01

22

11

Male

K

PDF Print

IGES
PARASOLID
STEP

PADS File

ASP-137972-01

34

17

Male

K

PDF Print

IGES
PARASOLID
STEP

PADS File

ASP-130366-01

46

23

Male

K

PDF Print

IGES
PARASOLID
STEP

PADS File

ASP-135020-01

70

35

Male

K

PDF Print

IGES
PARASOLID
STEP

PADS File

Target Side Connector
Simplex Connector Reference
Duplex Connector Reference
Pin Count
Positions
Description
Plating: K=30 µ" Gold
Prints
3D
PADS
HST-S22

HST-D22

22

11

Female

K

PDF Print

IGES
PARASOLID
STEP

PADS File

HST-S34

HST-D34

34

17

Female

K

PDF Print

IGES
PARASOLID
STEP

PADS File

HST-S46

HST-D46

46

23

Female

K

PDF Print

IGES
PARASOLID
STEP

PADS File

 

HST-D70

70

35

Female

K

PDF Print

IGES
PARASOLID
STEP

PADS File

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