Geek Speek Webinar – Advanced High Density Breakout Design & Crosstalk Mitigation Strategies

Presented by: Travis Ellis Today's high density connector arrays face significant challenges at the board attach region. Insertion loss and return loss impairments can be mitigated with careful design and simulation. More importantly especially with PAM4 signally are the crosstalk impairments from the associated via fields. Sympathetic resonators can allow crosstalk to skip across the entire filed with minimal attenuation. This presentation will highlight these issues and demonstrate how to improve the connector & board ecosystem to assure successful system designs.

(This is the second in a series of blogs, from Sandeep Sankararaman, Samtec’s Principal RF and Signal Integrity Engineer, discussing design strategies for high-bandwidth RF launches. The first is entitled “What Is An RF Connector Launch?” The third, coming next week, discusses GN...
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