Geek Speek Webinar – Pros & Cons of Thin Laminates in Power Distribution

Presented by: Istvan Novak PCB laminates with dielectrics thinner than 0.1mm have been available for a couple of decades. Their primary use have been in packages and flex circuits, but power distribution in large rigid boards can also use them. We will look at the electrical properties of thin laminates and go through the pros and cons when they are used for power distribution. Simulation and measured data on test boards and production boards will complete the talk.

(This is the second in a series of blogs, from Sandeep Sankararaman, Samtec’s Principal RF and Signal Integrity Engineer, discussing design strategies for high-bandwidth RF launches. The first is entitled “What Is An RF Connector Launch?” The third, coming next week, discusses GN...
If you’ve been paying attention to the Coming Soon section in our most recent web updates, you might have noticed we have been working on an upgraded Checkout system for the website for the last several months. We’re happy to announce that this application is now accepting orders...
As signal speeds increase, each part of the signal path getting to and from the device needs to work to higher frequencies.  Strategies that worked in the past no longer suffice and cheaper connectors no longer make the cut. Cable lengths and trace lengths need to get shorter to ...
This month, we released a major new version of our Checkout to a beta state, made some upgrades to how we show lead times online, made 3D model downloads easier from the Search, and released a few more content updates. Here are the major website updates to Samtec.com for July 202...
Something occurred to me recently. AI hardware system architectures are really applications-specific. Computing platforms from laptops, desktops, workstations and servers follow classical architectures. Inputs, outputs, a central processing unit, busses (control, data and memory)...