Samtec Solder Charge Technology

Samtec SEARAY connectors utilize Samtec's solder charge technology to increase the volume of solder in the joint, thereby making a more robust connection. In this video of the reflow process, we see the following components in action: Insulator body, Contact tail, Solder charge, Solder paste, Printed Circuit Board (PCB) Notice that the solder charges are in good contact with the solder paste. This is important because the solder charge material is pure solder, and the only flux available is provided by the solder paste. As the temperature in the reflow oven rises and the components approach thermal equilibrium, the flux in the paste activates and begins cleaning the solderable surfaces. Soon after, the melting temperatures of the solder and the solder charge are reached. As the solder joints form, notice how the SEARAY part settles and drops into place. While the coplanarity specification of the SEARAY is slightly higher than some surface mount connectors, this settling characteristic compensates for this and results in a consistent uniform array. Watch again as we speed up the process. The unique solder charge technology used in Samtec's SEARAY connectors creates a robust mechanical and electrical solution. For more information on the Samtec SEARAY connector family, head to the SEARAY family page: https://www.samtec.com/connectors/high-speed-board-to-board/high-density-arrays/searay Site: http://www.samtec.com Blog: https://blog.samtec.com Facebook: https://www.facebook.com/samtecinc/ Twitter: http://www.twitter.com/samtecinc LinkedIn: http://www.linkedin.com/company/samtec-inc