Samtec ZRAY Self-Aligning

Check out this video of how Samtec’s ZA8 Series, a high-density grid array interposer, self-aligns during reflow. We are frequently asked about the placement and processing of high density arrays. As shown above, the self-centering characteristics of the connector combined with the surface tension of the solder on the board draws the solder ball / interposer contact to the center of the pad. Of course, you also need to closely follow Samtec’s recommended footprint and stencil designs and machine-place the components. If you have questions or need more information, please contact the Interconnect Processing Group at Samtec: http://www.samtec.com/processing.aspx For additional information and pricing, please visit: https://www.samtec.com/connectors/high-speed-board-to-board/high-density-arrays/interposers Site: http://www.samtec.com Blog: https://blog.samtec.com Facebook: https://www.facebook.com/samtecinc/ Twitter: http://www.twitter.com/samtecinc LinkedIn: http://www.linkedin.com/company/samtec-inc

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