​​​​​​​​​​​​​​使用Samtec的高速板对板Solutionator®构建您的对接连接器套件​​​​​​​。​​​​​​​高速、高密度背板系统包括了各种对数和列数的ExaMAX®和XCede® HD。ExaMAX®可实现高达56 Gbps的性能,并使设计师能够选择优化密度或最大程度地减少电路板层数。XCede® HD是一个采用模块化设计的小型系统,可大幅节省空间并提升灵活性。


ExaMAX®高速背板互连器提供56 Gbps的电气性能。

  • 在4.2 mm列间距下可实现56 Gbps PAM的电气性能
  • 使设计师能够优化密度或最大程度地减少电路板层数
  • 即使在成角度对接的情况下也能提供两个可靠的接端子
  • 符合Telcordia GR-1217 CORE规格
  • 采用交错差分对设计的独立信号晶片;24或72对(电路板连接器)和16-96对(电缆组件)。
  • 每块信号晶片上均有单片压纹接地结构以减少串扰
  • 市场上产品中最小的插拔力:每个端子最大的插拔力为0.36 N
  • 背板电缆组件提供更高的数据传输速率来改善信号完整性和增加信号路径长度。
  • Samtec的EyeSpeed®超低偏斜双轴电缆提供更高的灵活性和可布线性
  • 对接无短桩效应
  • 压接针脚
  • 提供电源和引导模块
  • EBTM
  • EBCM
  • EBCF
  • EGBM
  • EGBF
  • EPTT
  • EPTS
  • EBCL
  • EBCB

XCede® HDXCede® HD高密度背板系统


  • 小巧的外形可大幅节省空间
  • 模块化设计提升了在应用中的灵活性
  • 高性能系统
  • 高密度背板系统——每线性英寸上多达84个差分对
  • 1.80 mm列间距
  • 3、4和6对设计
  • 4、6或8列
  • 12 - 48对
  • 提供多种信号/接地端子配置选项
  • 提供集成式电源、导引、锁合和侧壁
  • 85 Ω和100 Ω选项
  • 三个等级的上电次序实现了热插拔
  • 可为低速应用提供具有成本效益的设计
  • HDTF
  • HDTM
  • BSP
  • HPTS
XCede® HD

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