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三角形警报 Our manufacturing capacity has been influenced by this pandemic, but our global operations team has been working tirelessly to maximize our output and minimize the impact to all our customers while prioritizing COVID-19 critical response applications. Some part numbers are experiencing delays, but many are not. You can access real-time lead times online within your account, chat, or call us anytime for the latest information. ×

AcceleRate® HP高性能阵列

AcceleRate® HP高性能阵列

AcceleRate® HP 0.635 mm间距阵列具有112 Gbps PAM4的极致性能以及灵活的开放式端子设计。


特色

  • 0.635 mm间距开放式端子阵列
  • 性能可达56 Gbps NRZ/112 Gbps PAM4
  • 成本优化解决方案
  • 薄度为5 mm,堆叠高度为10 mm
  • 提供400个总端子数; 进程计划达到超过1,000个端子
  • 数据速率可与PCIe® Gen 5和100 GbE兼容
accelerate

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高速板到板及背板指南

高速板到板及背板指南

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Samtec高级互联设计技术中心

系列

APM6

0.635 mm间距AcceleRate® HP高性能阵列针脚

特色
  • 开放式端子设计,可实现接地和布线灵活性
  • 性能可达56 Gbps NRZ/112 Gbps PAM4
  • 提供400个总端子数; 进程计划达到超过1,000个端子
  • 薄度为5 mm,堆叠高度为10 mm
  • 数据速率可与PCIe® Gen 5和100 GbE兼容
0.635 mm间距AcceleRate® HP高性能阵列针脚

APF6

0.635 mm间距AcceleRate® HP高性能阵列插座

特色
  • 开放式端子设计,可实现接地和布线灵活性
  • 性能可达56 Gbps NRZ/112 Gbps PAM4
  • 提供400个总端子数; 进程计划达到超过1,000个端子
  • 薄度为5 mm,堆叠高度为10 mm
  • 数据速率可与PCIe® Gen 5和100 GbE兼容
0.635 mm间距AcceleRate® HP高性能阵列插座

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