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AcceleRate® HP高性能阵列

AcceleRate® HP高性能阵列

AcceleRate® HP 0.635 mm间距阵列具有112 Gbps PAM4的极致性能以及灵活的开放式端子设计。


特色

  • 0.635 mm间距开放式端子阵列
  • 性能可达56 Gbps NRZ/112 Gbps PAM4
  • 成本优化解决方案
  • 薄度为5 mm,堆叠高度为10 mm
  • 提供400个总端子数; 进程计划达到超过1,000个端子
  • 数据速率可与PCIe® Gen 5和100 GbE兼容
accelerate

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文献

高速板到板及背板指南

高速板到板及背板指南

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视频

Samtec高级互联设计技术中心

系列

APM6

0.635 mm间距AcceleRate® HP高性能阵列针脚

特色
  • 开放式端子设计,可实现接地和布线灵活性
  • 性能可达56 Gbps NRZ/112 Gbps PAM4
  • 提供400个总端子数; 进程计划达到超过1,000个端子
  • 薄度为5 mm,堆叠高度为10 mm
  • 数据速率可与PCIe® Gen 5和100 GbE兼容
0.635 mm间距AcceleRate® HP高性能阵列针脚

APF6

0.635 mm间距AcceleRate® HP高性能阵列插座

特色
  • 开放式端子设计,可实现接地和布线灵活性
  • 性能可达56 Gbps NRZ/112 Gbps PAM4
  • 提供400个总端子数; 进程计划达到超过1,000个端子
  • 薄度为5 mm,堆叠高度为10 mm
  • 数据速率可与PCIe® Gen 5和100 GbE兼容
0.635 mm间距AcceleRate® HP高性能阵列插座

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A popular demonstration at Super Computing 2019 (SC19) was a collaboration between Samtec and eSilicon that emulates next generation data center architectures for typical 19 inch rack-mount applications. In the video above, Ralph Page, Systems Architect at Samtec, walks us throug...
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