AcceleRate® mP高密度高速电源/信号阵列

AcceleRate® mP高密度高速电源/信号阵列

这些0.635 mm间距的电源/信号阵列达实现了64Gbps PAM4的速度,并具有22安培/刀片的旋转电源刀片和简化的分路区域 (BOR)。


特色

  • 一流的功率和信号密度
  • 电源插片可90º旋转,使其能够平等地获得热量释放,以实现均匀冷却,增加电流容量并减少拥挤
  • 支持64 Gbps PAM4(32 Gbps NRZ)应用
  • PCIe® 6.0兼容
  • 每个电源插片高达22安培
  • 端子开放式设计,具有布线和接地灵活性
  • 高密度多排设计
  • 轻薄型5 mm堆叠高度;高达16 mm的型号正在开发中
  • 总共4或8个电源插片;高达10个的型号正在开发中
  • 总共60或240个信号位置;更多位置的型号正在开发中
  • 0.635 mm信号间距
  • 可选定位销和焊接片,用于牢固连接至电路板
  • 用于盲插的顶针导柱
  • 查看全系列AcceleRate®产品
UDX6
UDM6热演示

AcceleRate® mP
(UDM6系列)

插片通过90º旋转平等获得热量释放,以实现均匀冷却,增加电流容量并减少拥挤。

下载和资源

资料

耐用型/电源互连方案指南

耐用型/电源互连方案指南

下载PDF文件

产品

UDM6

开发中:0.635 mm AcceleRate® mP高密度高速电源/信号针脚

特色
  • 0.635 mm信号间距
  • 每行2或4个电源插片(2行)
  • 每个电源插片高达22安培
  • 旋转电源插片可提高性能并简化分路区域 (BOR)
  • 每行10或40信号位置(6行)
  • 支持64 Gbps PAM4(32 Gbps NRZ)应用
  • PCIe® 6.0/CXL™ 3.1 capable
  • 轻薄型5 mm堆叠高度;高达16 mm的型号正在开发中
  • 定位销、焊接片和顶针导柱
  • 查看全系列AcceleRate®产品
开发中:0.635 mm AcceleRate® mP高密度高速电源/信号针脚

UDF6

开发中:0.635 mm AcceleRate® mP高密度高速电源/信号插座

特色
  • 0.635 mm信号间距
  • 每行2或4个电源插片(2行)
  • 每个电源插片高达22安培
  • 旋转电源插片可提高性能并简化分路区域 (BOR)
  • 每行10或40信号位置(6行)
  • 支持64 Gbps PAM4(32 Gbps NRZ)应用
  • PCIe® 6.0/CXL™ 3.1 capable
  • 轻薄型5 mm堆叠高度;高达16 mm的型号正在开发中
  • 定位销、焊接片和顶针导柱
  • 查看全系列AcceleRate®产品
开发中:0.635 mm AcceleRate® mP高密度高速电源/信号插座

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