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堆叠高度高达35 mm的加高型HD Mezz高密度端子开放式端子阵列。

特色

  • 适用于堆叠高度从20 mm到35 mm的各种应用
  • 引脚片敞开型设计
  • 性能:高达9 GHz / 18 Gbps
  • 整合了导柱设计,用以在对接和拆拔的过程中将接触伤害最小化
  • 表面焊接针脚,易于加工
  • 2.00 mm x 1.20 mm间距
  • 多达299个I/O口
  • 与Molex HD Mezz阵列互配
  • HD Mezz系Molex股份有限公司之商标

视频

Samtec高级互联设计技术中心

系列

HDAF

2.00mm x 1.20mm HD Mezz耐用性高密度引脚片开放式端子阵列插座

特色
  • 应用对应能力来构建从20 mm到35 mm的高度
  • 引脚片敞开型设计
  • 整合了导柱设计,用以在对接和拆拔的过程中将接触伤害最小化
  • 表面焊接针脚,易于加工
  • 性能:高达9 GHz / 18 Gbps
  • 2.00 mm x 1.20 mm间距
  • 多达299个I/O口
  • 与Molex HD Mezz阵列互配
  • HD Mezz系Molex股份有限公司之商标
  • 与Molex®为共同供货来源
2.00mm x 1.20mm HD Mezz耐用性高密度引脚片开放式端子阵列插座

HDAM

2.00 mm x 1.20 mm HD Mezz耐用型高密度引脚片开放式端子阵列

特色
  • 引脚片敞开型设计
  • 整合了导柱设计,用以在对接和拆拔的过程中将接触伤害最小化
  • 表面焊接针脚,易于加工
  • 性能:高达9 GHz / 18 Gbps
  • 2.00 mm x 1.20 mm间距
  • 多达299个I/O口
  • 与Molex HD Mezz阵列互配
  • HD Mezz系Molex股份有限公司之商标
  • 与Molex®为共同供货来源
2.00 mm x 1.20 mm HD Mezz耐用型高密度引脚片开放式端子阵列

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