LP Array™轻薄型端子开放式端子高密度阵列

LP Array™轻薄型端子开放式端子高密度阵列

堆叠高度低至4 mm、I/O总数高达320个的轻薄型端子开放式端子阵列。


系列概述

Searay IP海报

此系列轻薄型高速阵列采用双梁端子系统和1.27 mm x 1.27 mm(.050" x .050")间距栅格,实现了最高的接地和布线灵活性。此系统提供4 mm、4.5 mm和5 mm对接高度,以及采用4、6或8排配置的总计达320个端子。

此系列产品支持28+ Gbps应用,并获得了针对分路区域线路布线建议的Final Inch®认证,可节省设计者的时间和资金。标准无铅焊料压接简化了红外回流焊端接,并改进了焊点的可靠性。

特色

  • 4 mm、4.5 mm、5 mm堆叠高度
  • 多达320个I/O口
  • 4、6和8排设计
  • .050"(1.27 mm)间距
  • 双梁端子系统
  • 焊接压接针脚,易于加工
  • 性能高达18.5 GHz / 37 Gbps
Searay IP灵活性

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文献

SEARAY™ LP电子手册

LP Array™电子手册

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高速板到板应用指南

高速板到板应用指南

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技术文档

系列

JSO

插孔紧固精密电路板堆叠架高

特色
  • 传统架高
  • 有助于LSHM、SEAM/SEAF、SEAM8/SEAF8、LPAM/LPAF和其他高正向力连接器的拆拔
  • 降低电路板上元件损坏的风险
  • 板式堆叠高度为4.00 mm到16.00 mm
  • 提供压接和螺纹底座
插孔紧固精密电路板堆叠架高

LPAF

.050" LP Array™高速高密度轻薄型端子开放式端子阵列,插座

特色
  • 轻薄型4 mm、4.5 mm、5 mm堆叠高度
  • 多达320个I/O口
  • 4、6和8排设计
  • .050"(1.27 mm)间距
  • 双梁端子系统
  • 焊接压接针脚,易于加工
  • 性能高达18.5 GHz / 37 Gbps
  • 正在申请专利的Final Inch®技术
  • 56 Gbps PAM4性能
.050" LP Array™高速高密度轻薄型端子开放式端子阵列,插座

LPAM

.050" LP Array™高速高密度轻薄型端子开放式端子阵列,针脚

特色
  • 轻薄型4 mm、4.5 mm、5 mm堆叠高度
  • 多达320个I/O口
  • 4、6和8排设计
  • .050"(1.27 mm)间距
  • 双梁端子系统
  • 焊接压接针脚,易于加工
  • 56 Gbps PAM4性能
  • 正在申请专利的Final Inch®技术
.050" LP Array™高速高密度轻薄型端子开放式端子阵列,针脚

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