.050"系统

采用轻薄型和加高堆叠高度、直通式、耐用型、高密度和低成本设计的.050"(1.27 mm)间距电路板堆叠插座和针脚料带。


.050" x .050"微间距系统.050" x .050"微间距针脚和插座料带

采用各种电路板堆叠高度、组装方向和端子型号的.050"(1.27mm)x .050"(1.27mm)间距板到板系统。

特色
  • 系列高达10,000次循环
  • 多种电路板堆叠高度
  • 各种对接方向
  • 耐用型选项
  • 多种接触形式
  • 堆叠高度.235"(5.91 mm) - .754"(19.15 mm)
  • 可提供多达100个端子
系列
V
  • TFM
  • TFML
  • TFC
  • FW-SM
  • FW-TH
  • FTSH
  • FTS
  • FSH
  • HPT
  • SFM
  • SFML
  • SFC
  • SFMC
  • SFMH
  • CLP
  • FLE
帮我选择?
.050" x .050"微间距系统

In this video from EDI CON 2109, Samtec’s Jignesh Shah explains how Samtec Flyover® offers a 112 Gbps high-density escape from the system ASIC to the front panel. This is a live demonstration of 112 Gbps PAM4 traffic using Credo Semiconductors mixed signal SERDES with Samtec Flyo...
In the video above, Samtec’s Jignesh Shah and Kevin Burt explain that as data rate requirements approach and surpass 112 Gbps PAM4, developers are challenged with balancing increasing throughput, scalability, and density demands with concerns such as power consumption, signal int...
“Artificial Intelligence” and “AI” are all the rage. From high frequency trading on Wall Street to improved drug development, AI affects more aspects of human lives daily. Many AI solutions harness the computing power of cloud connectivity, edge computing, data centers and HPC. T...
mmWave. Massive MIMO. Beamforming. Full duplex. Connectors. Connectors? Yes, connectors. Really! This may seem like a new take on the old childhood game of “One of These Things”. However, all of these technologies (and others) are directly related to developing next-generation an...
“Where high frequency meets high speed,” says the tag line of past EDI CON USA events. What exactly is EDI CON? Technical specialists from across the RF, microwave, EMC/EMI, high-speed digital design and system integrator spectrum met annually. Why? For networking, training and l...