微电子

互连方案

新一代微电子技术需要更高的性能与集成性、先进的芯片技术及小型化。

Samtec广泛的微电子和高速互连专业知识及经验证的封装集成技术、微型化、晶圆级加工和信号完整性优化,使我们能够为先进的微电子应用提供独特的支持。

Nvidia had its annual GTC gathering of AI developers, fans, media, and gamers recently. The newly announced Nvidia Blackwell platform is scheduled for release in late 2024/early 2025. Blackwell will […] The post From AI to SI: Samtec Participates on Two Upcoming Webinars appeared...
There are several Advantages of Being a Samtec Co-Op, but at the heart of the Samtec Co-Op program, the main goal is to foster, nurture, and provide engaging, hands on […] The post An Interview with Business Co-Op’s at Samtec appeared first on The Samtec Blog....
OFC, the Optical Fiber Communications Conference, is all about optical networking and communications. Samtec was front and center showcasing 224 Gbps PAM4 solutions, next-generation transceivers for optical and copper, CXL-over-optics, […] The post Cutting Edge Copper and Optical...
Designing and optimizing a breakout region (or component launch) for a connector can be challenging. It often requires multiple back and forth iterations and analysis to adjust variables. Samtec’s new […] The post How to Design Component Launches Faster appeared first on The Samt...
It’s that time of year again. The world of CoMs, SoMs, interconnect and more all converge next week. The world of embedded systems is multifaceted – from hardware and software […] The post Guten Tag! Visit Samtec at embedded world 2024 in Nuremberg appeared first on The Samtec Bl...