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DPAM

.085" X .100" DP Array®差分对阵列针脚

配置零件

特色
  • 周边接地设计及交错引脚布线消除了间隙接地,易于板路由
  • 无需返回路径
  • 所需电路板层数更少
  • 性能:每对可达4 GHz(每个连接器速率可达兆兆位)
  • 最多有168个可用对
  • 10 mm堆叠高度
  • 插入力和拔出力更小
  • 焊接压接针脚
特色
  • 周边接地设计及交错引脚布线消除了间隙接地,易于板路由
  • 无需返回路径
  • 所需电路板层数更少
  • 性能:每对可达4 GHz(每个连接器速率可达兆兆位)
  • 最多有168个可用对
  • 10 mm堆叠高度
  • 插入力和拔出力更小
  • 焊接压接针脚
. .
.
.
. .
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