ZA8

0.80 mm超轻薄型微型阵列

配置零件

特色
  • 双重压缩端子或带锡球的单一压缩
  • 轻薄型 - 1 mm标准高度
  • 电路板堆叠、模块到板和LGA接口的理想选择
  • 提供简易的现场可升级性、方便更换
  • 最大程度地消除热膨胀问题
  • 标准配备多达400个I/O口,定制型号可达3,000个以上的I/O口
  • 0.80 mm(.0315")间距
  • 性能高达14 Gbps
特色
  • 双重压缩端子或带锡球的单一压缩
  • 轻薄型 - 1 mm标准高度
  • 电路板堆叠、模块到板和LGA接口的理想选择
  • 提供简易的现场可升级性、方便更换
  • 最大程度地消除热膨胀问题
  • 标准配备多达400个I/O口,定制型号可达3,000个以上的I/O口
  • 0.80 mm(.0315")间距
  • 性能高达14 Gbps
. .
.
. .
In the video above, Samtec’s Jignesh Shah and Kevin Burt explain that as data rate requirements approach and surpass 112 Gbps PAM4, developers are challenged with balancing increasing throughput, scalability, and density demands with concerns such as power consumption, signal int...
“Artificial Intelligence” and “AI” are all the rage. From high frequency trading on Wall Street to improved drug development, AI affects more aspects of human lives daily. Many AI solutions harness the computing power of cloud connectivity, edge computing, data centers and HPC. T...
mmWave. Massive MIMO. Beamforming. Full duplex. Connectors. Connectors? Yes, connectors. Really! This may seem like a new take on the old childhood game of “One of These Things”. However, all of these technologies (and others) are directly related to developing next-generation an...
“Where high frequency meets high speed,” says the tag line of past EDI CON USA events. What exactly is EDI CON? Technical specialists from across the RF, microwave, EMC/EMI, high-speed digital design and system integrator spectrum met annually. Why? For networking, training and l...
With the advent of the Commercial Off-The-Shelf (COTS) part being used in Mil / Aero, Space, Industrial, Transportation, and Automotive applications; manufacturers find themselves still looking for information on how those products will perform in severe environments. Here at Sam...