ZA8

0.80 mm超轻薄型微型阵列

配置零件

特色
  • 双重压缩端子或带锡球的单一压缩
  • 轻薄型 - 1 mm标准高度
  • 电路板堆叠、模块到板和LGA接口的理想选择
  • 提供简易的现场可升级性、方便更换
  • 最大程度地消除热膨胀问题
  • 标准配备多达400个I/O口,定制型号可达3,000个以上的I/O口
  • 0.80 mm(.0315")间距
  • 性能高达14 Gbps
特色
  • 双重压缩端子或带锡球的单一压缩
  • 轻薄型 - 1 mm标准高度
  • 电路板堆叠、模块到板和LGA接口的理想选择
  • 提供简易的现场可升级性、方便更换
  • 最大程度地消除热膨胀问题
  • 标准配备多达400个I/O口,定制型号可达3,000个以上的I/O口
  • 0.80 mm(.0315")间距
  • 性能高达14 Gbps
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