微电子系统支持

硅晶片到硅晶片的全力支持 -
因为每个互连点都至关重要

由于对更小、更快与更加集成化微电子元件需求的增加,设计师所面临的挑战也将以指数级增长。Samtec能够将信号完整性和先进的IC封装专长进行独特融合,为新一代技术所面临的挑战提供全通道系统支持。

从设计流程的早期阶段开始,包括封装设计、材料选择和PCB布线,通过深度分析、建模和仿真以及可用于67 GHz的测量验证服务,Samtec Teraspeed Consulting信号完整性小组的工程师可以帮助优化并验证您的高性能系统。

全通道专业知识和支持

封装和PCB设计


  • 移出/疏通优化
  • 疏通过渡结构
  • 布线和路由
  • 材料推荐
支持PCB

建模与仿真


  • 验证关键通道的实施与信号要求
  • 高带宽全波模拟
  • 封装和PCB设计的设计规则
  • 通过高性能计算(HPC)进行仿真
支持模拟

分析、测试与验证


  • 表征
    (67 GHz及以上频率)
  • 封装、PCB和系统级信号完整性/电源完整性
  • 后期设计测试、模拟与测量
  • 后期设计测试、模拟与测量
支持验证
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