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三角形警报 Our manufacturing capacity has been influenced by this pandemic, but our global operations team has been working tirelessly to maximize our output and minimize the impact to all our customers while prioritizing COVID-19 critical response applications. Some part numbers are experiencing delays, but many are not. You can access real-time lead times online within your account, chat, or call us anytime for the latest information. ×

Altera®

Altera®

概述

Altera® HSMC定义了高速夹层卡接口的电气和机械性能。该规范对夹层卡与主板之间的通信和连接进行了标准化。利用当今FPGA设备的高性能I/O功能,生产商可打造连接多个主板的单个夹层卡。与此类似,他们也可以打造能够利用多个不同的预制夹层卡的主板。

Altera标识
HSMC标识

连接器

Altera® HSMC - Q Strip®(QSH/QTH)

规范定义的HSMC连接器是基于0.50 mm间距Q Strip® QSH/QTH系列高速板到板连接器。这些连接器划分为三个“库”。每个相应连接器中的库1都已移除第三个信号端子,以实现千兆级差分信号。每个相应连接器中的库2和库3则具有有完整的整排信号端子,用于各种单端接口信号。

Altera® HSMC指定连接器(Q Strip®)
 

Samtec PN

连接器
 
三个“库”
间距 排数 打印版资料 3D
PADS
ASP-122952-01

公针类连接器

0.5 mm

2 打印PDF IGES
PARASOLID
STEP

PADS

ASP-122953-01

母针类连接器

0.5 mm

2 打印PDF IGES
PARASOLID
STEP

PADS

Altera® HSMC指定电缆 (Q Strip®)
 

Samtec PN

电缆
 
类型
间距 排数 打印版资料 1电缆末端连接器
2电缆末端连接器
HDR-128291-XX

1个移动电源,公针类连接器调试电缆

0.5 mm

2 打印PDF IGES
PARASOLID
STEP

IGES
PARASOLID
STEP

HDR-131992-XX-HQDP

3个移动电源,公针到母针类连接器电缆

0.5 mm

2 打印PDF IGES
PARASOLID
STEP

PADS
PARASOLID
STEP

扩展中的HSMC生态系统

扩展中的HSMC生态系统

Altera®高速夹层卡(HSMC)规范为各个制造商的互操作主板和夹层卡提供了灵活的设计方法。通过定义适配器的电气和机械特性,HSMC得以将模块化架构标准化。HSMC的主要特点包括:

  • 高速协议如PCI Express®、Gigabit Ethernet和AMC的优化
  • HSMC互连提供JTAG、高速串行I/O以及SE和DP信号映射
  • 可编程I/O和灵活的布线选项
  • 三库连接器设计实现SE和DP信号

Terasic ICB-HSMC

Terasic的ICB-HSMC(工业通信主板)设计着眼于工业通信。ICB允许实时发送串行通信协议,从而在自动化和仪表等应用中实现可靠的分布式控制。

主要特性包括:

  • HSMC(高速夹层卡)兼容
  • 通过HSMC支持RS232、RS485和CAN(控制器局域网)
  • 40端子扩展端口

Samtec特性产品:

  • Altera® HSMC(0.50 mm间距无铅型)公针类连接器 (Q Strip® ASP-122952-01)
HSMC图像

测试报告

Altera® HSMC标准

如有关于Altera® HSMC标准的问题和需要更多信息,请联系我们:

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