SI评估套件:电缆

SI评估套件:电缆

随着数据速率不断增加,PCB上的走线长度也在逐渐缩短。Samtec的高速电缆组件可简化PCB设计,并限制高数据速率应用中的信号衰减。Samtec电缆组件SI评估套件为系统设计师和SI工程师提供了一个易用型平台,用于测试许多Samtec畅销的电缆组件产品。

每个套件都包括评估平台、校准板、技术文档和测试报告。此外,每个套件在交付客户之前,均需由Samtec的信号完整性专家进行测试和验证。

SI评估套件:电缆

套件名称 描述
AcceleRate® Flyover® SI评估套件
(REF-203425-X.XX-XX)
(REF-212901-X.XX-XX-XX)
 

AcceleRate® Flyover® SI评估套件通过ARF6产品对接连接器和双芯电缆长度以及精密射频连接器选项路由高精度差分对。

FLYOVER REF203425
AcceleRate® HP Flyover® SI评估套件
(REF-230038-X.XX-XX)
(REF-231683-X.XX-XX)
 

AcceleRate® HP Flyover® SI评估套件通过APF6-L对接连接器、双芯电缆长度和精密射频连接器选项路由高速信号。

HP Flyover REF-231683
AcceleRate® Mini Flyover® SI评估套件
(REF-231380-X.XX-XX)
 

AcceleRate® Mini Flyover® SI评估套件通过AMF6产品对接连接器和双芯电缆长度以及精密射频连接器选项路由高精度差分对。

Mini Flyover REF-231380
ExaMAX®背板电缆SI评估套件
(REF-211825-XX)
 

适用于评估ExaMAX®背板电缆组件的SI测试平台。

ExaMAX电缆
FQSFP SI评估套件
(REF-205303-X.XX-XX)
 

用于FQSFP产品双芯电缆组件(含各种终端2选项)特征描述的SI测试平台。

ref 202303 board
FQSFP-DD SI评估套件
(REF-203424-X.XX-XX)
(REF-205605-X.XX-XX)
 

FQSFP-DD产品双芯电缆组件(含各种终端 2选项)特征描述SI测试平台

FLYOVER REF203424
NovaRay® Flyover® SI评估套件(REF-213732-X.XX-01)  

用于评估0.80 mm间距NovaRay®电缆组件的SI测试平台。

novaray flyover
Si-Fly™ Flyover® SI评估套件 (REF-224260-X.XX-01)  

用于评估Si-Fly™电缆组件的SI测试平台

Si-Fly Flyover SI评估套件
Nvidia had its annual GTC gathering of AI developers, fans, media, and gamers recently. The newly announced Nvidia Blackwell platform is scheduled for release in late 2024/early 2025. Blackwell will […] The post From AI to SI: Samtec Participates on Two Upcoming Webinars appeared...
There are several Advantages of Being a Samtec Co-Op, but at the heart of the Samtec Co-Op program, the main goal is to foster, nurture, and provide engaging, hands on […] The post An Interview with Business Co-Op’s at Samtec appeared first on The Samtec Blog....
OFC, the Optical Fiber Communications Conference, is all about optical networking and communications. Samtec was front and center showcasing 224 Gbps PAM4 solutions, next-generation transceivers for optical and copper, CXL-over-optics, […] The post Cutting Edge Copper and Optical...
Designing and optimizing a breakout region (or component launch) for a connector can be challenging. It often requires multiple back and forth iterations and analysis to adjust variables. Samtec’s new […] The post How to Design Component Launches Faster appeared first on The Samt...
It’s that time of year again. The world of CoMs, SoMs, interconnect and more all converge next week. The world of embedded systems is multifaceted – from hardware and software […] The post Guten Tag! Visit Samtec at embedded world 2024 in Nuremberg appeared first on The Samtec Bl...