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HSEC8-DP SI评估套件

HSEC8-DP SI评估套件

用于评估0.80 mm间距Edge Rate®差分对高速插卡式连接器的SI测试平台


概述

Samtec 0.80 mm间距Edge Rate®差分对高速插卡式连接器为典型插卡式应用提供56 Gbps PAM4性能。HSEC8-DP SI评估套件为系统设计人员和SI工程师提供了测试HSEC8-DP连接器的一种易用型解决方案。

HSEC8-DP SI评估套件提供具有强大机械设计的高质量系统,可单独用于HSEC8-DP连接器。有关更多信息,请通过KitsAndBoards@samtec.com联系Samtec的技术专家。

HSEC8-DP SI评估套件
Samtec零件编号REF-210637-{[#1]},如图

特色

  • 外形紧凑的两个PCB系统
  • 一个PCB包含HSEC8-DP系列连接器 (HSEC8-120-01-L-DP-A-WK-K)
  • 另一个PCB包含可与HSEC8-DP系列对接的0.80 mm间距插卡式连接器
  • 将高速差分对(总共8个)从HSEC8-DP系列和插卡式路由至高精度射频连接器
  • 支持多种高精度射频连接器选项 (2.4 mm/2.92 mm SMA)
  • 通过Samtec FinalInch® BOR PCB追踪路由优化的‘SI性能
  • 通过直接连接到TDR/TDT来启用时域测量
  • 通过直接连接到VNA来启用频域测量

应用

  • 服务器
  • 存储
  • 网络
  • 测试和测量
  • 有线通信
  • 无线通信

订购信息

有关更多详情,请参见图样REF-210637-X.XX-XX

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