56 Gbps PAM4 SI Evaluation Kit Demonstration |
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This active product demonstration shows Samtec's AcceleRate® HP and Bulls Eye® connector systems running at 56 Gbps, from a Credo Bald Eagle silicon. |
56 Gbps PAM4 HSEC8-DP SI Evaluation Kit Demonstration |
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This live product demonstration shows a Samtec high-speed edge card connector (HSEC8-DP) running at 56 Gbps PAM4, with incredible performance. It's powered by a Xilinx® Virtex® UltraScale+ VCU129 FPGA Evaluation Kit. |
UCLA, Samtec - Ocean Processor For CMS, CERN with FireFly™ |
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Maxx Tepper of UCLA gives us a brief overview of the Ocean High-Throughput processor to be used in the real-time event selection system of the CMS experiment at the CERN large hadron collider. The Ocean board incorporates Samtec FireFly™ optical cable assemblies. Maxx explains how they are used and their performance. |
A Cable Backplane Solution For 112 Gbps PAM4 Architecture |
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From DesignCon 2020, Scott McMorrow walks us through a live demo of 112 Gbps PAM4 Samtec Flyover® cable products running with the latest Xilinx® advanced processor, targeted for 7 nm, 112 Gbps SerDes FPGA applications. |
Direct Connect To The Silicon Package |
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5G, high performance computing, emulation, AI and machine learning technology segments all benefit from bleeding edge speed and reach, especially at 56 and 112G PAM4. This video explains how Samtec Direct Connect™ technology enables 56 Gbps PAM4 and 112 Gbps PAM4 systems. |
70 GHz High-Performance Test Solutions |
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This live product demonstration, from DesignCon 2020, shows how Bulls Eye® can be used effectively in a real-life evaluation board environment. |
Immersion Cooling Of Optical Transceivers - SC19 |
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In this video from SuperComputing 2019, Arlon Martin and the Samtec Optical Group are demonstrating the latest developments in full-scale immersion cooling. Using Samtec Flyover® technology and FireFly™ optical modules, Arlon explains the tradeoffs between air, conduction and liquid cooling. |
PCB Connectors And Twinax Cable Systems for AI Hardware |
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This demonstration shows that Samtec Flyover® technology and high-speed interconnect systems can effectively operate in 32 GT/s silicon test platforms that incorporate up to eight riser cards with PCIe® 5.0 AI usage models. |
Chassis-to-Chassis, Mid-Board Connectivity |
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This chassis-to-chassis demonstration shows mid-board connectivity via a five meter cabled backplane architecture. It emulates next generation data center architectures for typical 19 inch rack mount applications. From Super Computing 2019. |
112 Gbps PAM4 Front Panel to Mid-Board - Samtec Flyover® |
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This demo, from DesignCon 2020, is a collaboration between Samtec and Alphawave. It emulates next generation data center equipment architectures, and incorporates Samtec Flyover® to improve signal integrity and architectural flexibility. |