USB Interfaces

Standard, rugged and sealed USB or Mini USB 2.0 interfaces with choice of Type A, Type B and Type AM.


USB Board Interconnects and Cable AssembliesUSB Board Interconnects and Cable Assemblies

Samtec's USB systems feature both board level connectors and rugged overmold cables.

Features
  • USB and Mini USB
  • Various orientations, types, terminations
  • Rugged options available
  • Rugged overmold cables with various end options
  • 2.0 version available
  • High-cycles
Series
V
  • MUSB
  • MUSBS
  • SPM
  • USB-A
  • USB-AM
  • USB-B
  • USBR-A
  • USBR-B
USB Board Interconnects and Cable Assemblies

SEARAY™ is a family of high speed, high density connectors. SEARAY gives designers tons of design flexibility, much more than any other array product in the connector industry. DESIGN FLEXIBILITY SEARAY is on a 1.27 mm X 1.27 mm grid. This is an open pin field grid array, which m...
Samtec’s FFSD, FFMD Series are micro-pitch, high reliability, high cycle IDC cable assemblies. TIGER EYE™ CONTACT The connector systems incorporate the Tiger Eye™ contact. Tiger Eye is a rugged contact for micro pitch interconnects; it is ideal for high reliability and high matin...
In this short video, Steve Groothuis, Chief Technology Officer for Samtec Microelectronics, explains Glass Core Technology (GCT), why it matters in advanced substrate packaging, and the solutions it provides. GCT is a proprietary process that leverages the performance benefits of...
Since we released Samtec Solutionator 2.0, our updated parametric search tool, the most requested feature from users has been the ability to export the results of the data grid. We’re happy to announce that with our most recent update, you can now export up to 1,000 rows of data ...
Interconnects for the military/aerospace industry are used in a variety of applications, including communication and navigation equipment, radar, airborne, marine and space guidance control, and electronic warfare, to name a few. While Samtec products are used in commercial appli...
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