SILICON-TO-SILICON APPLICATION SOLUTIONS

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Samtec’s full line of high speed interconnect products was on display and in demonstrations at Electronica 2018.  Focus products included high speed mezzanine high speed cable assemblies high speed backplane connectors active optical cable assemblies 28 G Product Demonstrator In ...
If you aren’t from the packaging world, then chances are likely you might think “packing” refers to objects being placed in to a box instead of packaging integrated circuits (IC’s) on a substrate. Packaging has advanced since it began, and as with many areas it is all in effort t...
October was a big month for Samtec.com. We released the first phase of a long project to translate Samtec.com into four additional languages, a new section in the main navigation, improved our mobile experience for our growing mobile user base, and added several new Standards pag...
Samtec is presenting new products and new technologies at Electronica 2018, as well as our full line of interconnects including High Speed Board-to-Board, High Speed Cable Assemblies, Micro/Rugged, Flexible Stacking, Optics and Precision RF.  We are in a new location this year:  ...
Next-generation high-performance copper and optical interconnects must solve multiple technical challenges including higher data rates, increased system and chassis density, and improved signal integrity. Samtec’s diverse product and technology portfolio provides system designers...